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Measuring method for thermally simulating tensile stress of small sample

A technology of tensile stress and measurement method, applied in the direction of measurement devices, instruments, scientific instruments, etc., can solve the problem of inability to meet the size and other problems, and achieve the effect of simple device and easy operation of the device

Inactive Publication Date: 2014-03-12
李明贤
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Problems solved by technology

However, in the development and research of new materials with these devices, there is always the problem of how to detect the conventional mechanical properties (such as tensile stress, etc.) , there is a certain requirement for the minimum length of the sample, which usually needs to be greater than 40 mm, and the maximum sample obtained by the general thermal simulation experiment is only a columnar sample with a maximum diameter of φ15 mm and a height of less than 12 mm, which obviously cannot meet the requirements of conventional mechanical experiments. size of

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  • Measuring method for thermally simulating tensile stress of small sample

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Embodiment Construction

[0012] Below in conjunction with accompanying drawing, the present invention is described in detail as follows:

[0013] As we all know, in the state of pure shear stress, the tensile stress in conventional mechanical properties has the following relationship with pure shear stress: σ=τ. However, since the shearing process in the test process is not an ideal state of pure shearing stress, there is a linear relationship between σ and τ as follows: σ=Kτ, the value of K is mainly related to the gap between the cutting edges and the lubrication state during the shearing process, and is related to Material properties are irrelevant, generally between 1.6-1.7.

[0014] Therefore, the present invention provides a thermal simulation small sample tensile stress measurement method. In the first step, the conventional tensile sample mechanical property detection and the quasi-pure shear mechanical property detection are carried out on the material plates of different strength levels at t...

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Abstract

The invention discloses a measuring method for simulating the tensile stress of a small sample. The method comprises the following steps of: 1, performing conventional tensile sample mechanical property detection and quasi-pure shear mechanical property performance detection on material plates of different strength grades simultaneously and linearly reducing a multiple K between tensile stress sigma and shearing stress tau; 2, performing quasi-pure shear mechanical property performance detection on a thermal simulation small sample to be detected to obtain shearing stress tau; and 3, calculating the tensile stress sigma of the thermal simulation small sample to be detected according to the multiple K relation between the tensile stress sigma and the shearing stress tau, i.e., sigma is equal to Ktau. A device for detecting the shearing stress comprises a female mold, a pressure plate mold and a jumper bar seat, wherein the jumper bar seat is provided with a jumper bar; and the female mold and the pressure plate mold are provided with a positioning groove and a positioning pin at corresponding positions respectively. By adopting the method, the detection problem of the conventional mechanical property of the small sample can be solved effectively. Moreover, the used device is simple and is easy to operate.

Description

technical field [0001] The invention relates to the detection field of conventional mechanical properties of small samples, in particular to a thermal simulation small sample tensile stress measurement method and a device used therefor. Background technique [0002] In today's new material research fields, such as nanomaterial research, amorphous material research, semiconductor materials, thermal simulation experiments, etc., the size of the prepared samples is very small either due to the material itself or due to the constraints of the experimental conditions. Small, it is difficult to use conventional experimental methods to measure its mechanical properties, such as tensile strength, yield strength, elongation, and processing strain rate. In particular, thermal simulation technology is a very important and effective technology in the current material research field, and it is also very popular in the research of steel materials. At present, the thermal simulation equip...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/00
Inventor 李明贤王成芳
Owner 李明贤