High speed transmission interface connector

Abstract

The embodiment of the invention discloses a high speed transmission interface connector, which comprises a first connector and a second connector. The first and second connectors are provided with a transmission interface respectively, and are correspondingly arranged on the opposite two sides of a circuit board. The end faces, provided with the transmission interfaces, of the first and second connectors are flush. The rear ends of the first and second connectors are provided with socket pins which are electrically connected with the circuit board respectively. Joints between each socket pin of the first and second connectors and the circuit board are distributed in a staggering way. In the embodiment of the invention, the first and second connectors are used pairwise, and are arranged on the two opposite sides of the same position of the circuit board respectively, so the area, occupied by the connector, of the circuit board is saved, the area of the circuit board of the communication product in the embodiment of the invention is smaller, the volume of the communication product is smaller, and the miniaturization needs of the communication product are satisfied.

Description

technical field [0001] The present invention relates to the field of network technology, and more specifically relates to a high-speed transmission interface connector. Background technique [0002] As a transmission device that can be used for photoelectric conversion, high-speed transmission interface connectors are widely used in network products. At present, the types of high-speed transmission interface connectors mainly used in the industry include SFP, QSFP, XFP, CXP and other high-speed transmission interface connectors. [0003] Among them, the CXP high-speed transmission interface connector has the highest data transmission speed of 120G / s. In order to obtain a higher data transmission speed, in the prior art, a technical solution adopted is to arrange multiple single-port CXP high-speed transmission interface connectors side by side on the circuit board. [0004] In the prior art, when producing and designing communication products with high-speed transmission i...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, when producing and designing communication products with high-speed transmission interface connectors with a data transmission speed above 120G / s, since multiple CXP high-speed transmission interface connectors need to be arranged side by side on the circuit board, it takes up a lot of time. The area of ​​the circuit board is increased, which increases the area of ​​the circuit board, so that the volume of the communication products produced is relatively large, which cannot meet the needs of miniaturization of communication products.

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