Electronic device shell and manufacture method thereof
A technology for electronic devices and manufacturing methods, applied in the direction of sealed casings, electrical equipment casings/cabinets/drawers, electrical components, etc., can solve problems such as large weight, low strength, and affecting signal transmission and reception, and achieve beautiful appearance, high strength, and combination firm effect
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[0030] see figure 1 and figure 2 The case 10 of the electronic device in the preferred embodiment of the present invention takes a mobile phone back cover as an example, which includes a metal part 12 and a plastic part 14 combined with the metal part 12 .
[0031] The metal piece 12 is substantially rectangular, and includes a first portion 122 , a second portion 124 opposite to the first portion 122 , and a connection portion 126 between the first portion 122 and the second portion 124 . The first portion 122 is adjacent to one end of the metal member 12 , and the second portion 124 is adjacent to another opposite end of the metal member 12 .
[0032] The first portion 122 defines a plurality of first stepped holes 1221 . The distribution density of the first stepped holes 1221 on the metal piece 12 gradually decreases from the first portion 122 to the connecting portion 126, and the diameter of the first stepped holes 1221 gradually decreases from the first portion 122 t...
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