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Housing of electronic device and manufacturing method of housing

A technology for electronic devices and manufacturing methods, applied in the directions of sealed enclosures, electrical equipment enclosures/cabinets/drawers, electrical components, etc., can solve problems such as affecting the appearance, complex manufacturing process and assembly of the enclosure, affecting the function and service life of electronic devices, etc. Strong three-dimensional, strong overall effect

Inactive Publication Date: 2011-09-28
SHENZHEN FUTAIHONG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to be able to assemble together, the shell parts must be provided with corresponding hooks, buckles and other fastening structures, which makes the manufacturing process and assembly of the shell complicated.
Moreover, the shell formed by assembly can feel the assembly gap and steps from both visual and tactile senses, which affects the appearance
At the same time, water and dust are easy to enter the electronic device from the assembly gap, which may affect the function and service life of the electronic device

Method used

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  • Housing of electronic device and manufacturing method of housing
  • Housing of electronic device and manufacturing method of housing
  • Housing of electronic device and manufacturing method of housing

Examples

Experimental program
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Embodiment Construction

[0048] see figure 1 , the electronic device case 100 of the preferred embodiment of the present invention is described by taking a mobile phone case as an example. The electronic device housing 100 includes a body 10 and a cover 20 .

[0049] The body 10 is in the shape of a hollow sleeve, which is formed by joining a front wall 101, two side walls 102 respectively connected to both sides of the front wall 101, a rear wall 103 opposite to the front wall 101, and a top wall 104. . The body 10 has an accommodating chamber 105 and an open end 106 . The open end 106 is used for accommodating electronic components of the electronic device in the accommodating chamber 105 . see further figure 2 and image 3 , the main body 10 includes a transparent first injection body 11 , a decoration layer 13 and a transparent second injection body 15 .

[0050] The first injection body 11 is formed of transparent thermoplastic resin, such as polycarbonate (PC), acrylonitrile-styrene-butad...

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PUM

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Abstract

The invention provides a housing of an electronic device. The housing comprises a body and a cover body, wherein the body takes a shape of a hollow sleeve with an opening end and a closed end and comprises a first transparent injection body, a decorative layer and a second transparent injection body; the decorative layer is formed on a surface of the first injection body and partially covers the first injection body, and the part of the first injection body, which is not covered by the decorative layer, forms a transparent window part; the second injection body is formed on the decorative layer and the window part; and the first injection body formed with the decorative layer and the second injection body are integrally formed into the body in double-injection formation manner, and the opening end of the body is covered by the cover body. The invention further provides a method for manufacturing the housing of the electronic device.

Description

technical field [0001] The invention relates to an electronic device casing and a manufacturing method thereof. Background technique [0002] The casing is one of the main components of electronic devices, and it is widely used in electronic devices such as telephones and music players. [0003] Existing housings of electronic devices generally include a plurality of housing parts (for example, including an upper cover and a lower cover), and these housing parts are formed separately, and then these housing parts are assembled to form a complete housing. In order to be able to assemble together, the shell parts must be provided with corresponding hooks, buckles and other fastening structures, which makes the manufacturing process and assembly of the shell complicated. Moreover, the shell formed by assembling can sense assembly gaps and steps visually and tactilely, which affects the appearance. At the same time, water and dust are easy to enter into the electronic device f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K5/06B29C45/14B29C45/16B29C45/26
CPCB29L2031/3481B29C2045/1673B29K2995/0026B29K2995/0087B29K2995/002B29C45/14811B29C45/1671H05K5/0243
Inventor 廖凯荣童鹏程何柏锋杨仕伟
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
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