Housing of electronic device and manufacturing method of housing
A technology for electronic devices and manufacturing methods, applied in the directions of sealed enclosures, electrical equipment enclosures/cabinets/drawers, electrical components, etc., can solve problems such as affecting the appearance, complex manufacturing process and assembly of the enclosure, affecting the function and service life of electronic devices, etc. Strong three-dimensional, strong overall effect
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[0048] see figure 1 , the electronic device case 100 of the preferred embodiment of the present invention is described by taking a mobile phone case as an example. The electronic device housing 100 includes a body 10 and a cover 20 .
[0049] The body 10 is in the shape of a hollow sleeve, which is formed by joining a front wall 101, two side walls 102 respectively connected to both sides of the front wall 101, a rear wall 103 opposite to the front wall 101, and a top wall 104. . The body 10 has an accommodating chamber 105 and an open end 106 . The open end 106 is used for accommodating electronic components of the electronic device in the accommodating chamber 105 . see further figure 2 and image 3 , the main body 10 includes a transparent first injection body 11 , a decoration layer 13 and a transparent second injection body 15 .
[0050] The first injection body 11 is formed of transparent thermoplastic resin, such as polycarbonate (PC), acrylonitrile-styrene-butad...
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