Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof

A soft-rigid combination, printed board technology, applied in printed circuit manufacturing, printed circuit, multi-layer circuit manufacturing, etc., can solve the problems of poor operability and high production cost, and achieve the effect of ensuring performance

Active Publication Date: 2011-11-23
XIAMEN INNOV INFORMATION TECH
View PDF5 Cites 31 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to provide a new type of rigid-flex printed board to solve the problems of high production cost and poor operability of rigid-flex printed boards in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof
  • Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof
  • Novel rigid-flexible PCB (printed circuit board) and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In order to further explain the technical solutions of the present invention, the present invention will be described in detail below through specific embodiments.

[0038] like figure 1 and figure 2 As shown, it is the first embodiment of a new type of flexible-rigid printed board 100 according to the present invention.

[0039] The FPC core board 1 is formed of FPC. Specifically, the FPC includes a FPC base material 11 and a copper foil layer 12 on both sides of the FPC base material 11 , and the copper foil layers 12 on both sides of the FPC base material 11 . A cover film 13 is formed on the outer side. In this embodiment, the PI layer is selected as the substrate 11 of the flexible board. Of course, the FPC can also be other structures in the field, and will not be described one by one.

[0040] The two pieces of hard board base material 2 are located on both sides of the soft board core board 1, and each piece of hard board base material 2 and the soft board c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a novel rigid-flexible PCB (printed circuit board) and a manufacturing method thereof. The novel rigid-flexible PCB comprises a flexible core board made from an FPC (flexible printed circuit) and two rigid substrates arranged at the two sides of the flexible core board, each rigid substrate and the flexible core board are adhered together through viscose; the flexible coreboard is provided with a winding and folding region, each rigid substrate is provided with a window at the position corresponding to the winding and folding region, and one side far away from the flexible core board, of each rigid substrate is provided with a copper foil layer which can cover the window on the rigid substrate in an adhesion mode. The manufacturing method comprises preliminary treatment, combination lamination treatment and sequent treatment. The invention can play a role in ensuring the performance of the flexible core board; and meanwhile, the moulding mode of the rigid-flexible PCB related in the invention also has the characteristics of low production cost and strong operability.

Description

technical field [0001] The invention relates to the field of flexible-rigid combination printed boards, and more particularly relates to a novel flexible-rigid combined printed board and a manufacturing method thereof. Background technique [0002] In the production process of flex-rigid printed boards, the PI material in the flex-rigid printed board will expand in a strong alkaline solution, which will affect the reliability of the product. Therefore, people need to consider the above problems and add them to the flex-rigid board. Combined with the design of the printed board production process. [0003] At present, two traditional processes are generally used in the production of flexible and rigid printed boards, namely the windowing method and the laser cutting method. [0004] The window opening method means that the hard board in the folded area is pre-fenced before the copper immersion is produced, and the folded area is filled and protected during copper immersion. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14H05K3/00H05K3/46
Inventor 李金华
Owner XIAMEN INNOV INFORMATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com