Gyroscope and manufacturing method thereof

A technology of gyroscope and support ring, applied in the field of semiconductor manufacturing, can solve problems such as inability to integrate gyroscope, and achieve the effects of increasing inertia, improving quality and enhancing stability

Active Publication Date: 2011-12-14
ZHEJIANG JUEXIN MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the semiconductor manufacturing process, it is impossible to integrate the gyroscope with a large mass of inertial mass into the integrated circuit

Method used

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  • Gyroscope and manufacturing method thereof
  • Gyroscope and manufacturing method thereof
  • Gyroscope and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0051] It can be seen from the background technology that all gyroscopes have a mass ring, and the greater the mass of the mass ring, the greater the inertia, which can make the gyroscope better in stability and anti-environmental vibration and noise. However, due to the limitation of the semiconductor manufacturing process , it is impossible to form a gyroscope with a mass ring with a large mass in an integrated circuit.

[0052] The inventor of the present invention obtains a kind of gyroscope through a large amount of experiments, comprises: substrate, has the bottom drive electrode and the bottom measurement electrode that is positioned at the bottom drive electrode periphery in the substrate; There is a closed cavity in the cavity; the cavity includes: a central axis located on the substrate; a support ring placed on the substrate and capable of rotating around the central axis; a mass located on the periphery of the support ring and having the same central axis as the sup...

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Abstract

The invention provides a gyroscope and a manufacturing method thereof. The gyroscope comprises: a substrate, bottom driving electrodes inside the substrate and bottom measuring electrodes located at the periphery of the bottom driving electrodes; a dielectric layer on the substrate, and a closed cavity arranged in the dielectric layer. The cavity includes: a central shaft mounted on the substrate; a support ring that is positioned on the substrate and can rotate around the central shaft; a mass ring that is located at the periphery of the support ring and shares the common central shaft with the support ring; cantilevers connecting the support ring and the mass ring and supporting the mass ring suspended inside the cavity; elastic parts positioned in an area among the support ring, the mass ring and neighboring two cantilevers; a top driving electrode covering the support ring, the mass ring, the cantilevers and the elastic parts; conductive plugs connecting the top driving electrode over the elastic parts and the bottom driving electrodes. The mass ring includes an insulating layer and a weight layer under the insulating layer. The gyroscope of the invention has greatly improved stability and performances.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a gyroscope and a manufacturing method thereof. Background technique [0002] Gyroscope is an instrument that can accurately determine the orientation of moving objects. It is an inertial navigation instrument widely used in modern aviation, navigation, aerospace and defense industries. The development of gyroscopes is of great strategic significance to the development of a country's industry, national defense and other high technologies. The traditional gyroscope mainly refers to the mechanical inertial gyroscope. Due to the complex structure of the mechanical inertial gyroscope, the requirements for the process structure are very high, so its accuracy is restricted by many aspects. [0003] An existing miniature vibrating dual-axis sensing gyroscope, such as figure 1 As shown, a base 54 is included, a central axis 55 is arranged at the center of the base 5...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/56G01C19/5712
CPCG01C19/04G01C19/5712Y10T74/1296Y10T74/1282
Inventor 毛剑宏韩凤芹唐德明
Owner ZHEJIANG JUEXIN MICROELECTRONICS CO LTD
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