Temperature-sensitive printing head and manufacturing method thereof
A thermal print head, printing direction technology, applied in printing and other directions
Active Publication Date: 2014-07-30
SHANDONG HUALING ELECTRONICS
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Problems solved by technology
[0013] The purpose of the present invention is to solve the above-mentioned technical deficiencies, and propose a thermal print head and its production method that are less prone to disconnection and short circuit phenomena, can reduce costs, increase printing speed, and improve printing effects
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[0031] The present invention will be further described below in conjunction with accompanying drawing:
[0032] Such as figure 1 and figure 2 Shown: a thermal print head, including a substrate 70 made of insulating material, electrode wires 40 on the substrate 70 and several heating resistors 50 arranged in a straight line, one end of the electrode wires 40 is provided with a wire pattern 40a. The protective layer 60 formed on the body 50 and at least a part of the electrode wires 40 by thick film method or spraying method, the direction in which the heating resistor 50 is arranged is called the main printing direction, and the direction perpendicular to the main printing direction in the plane of the insulating substrate 70 is called It is the sub-printing direction, which is characterized in that a base glaze layer 10 is provided on the substrate, the thickness of the base glaze layer 10 is not greater than 20 μm, and a thermal resistance glaze layer 20 and an auxiliar...
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Abstract
The invention discloses a temperature-sensitive printing head and a manufacturing method thereof. The temperature-sensitive printing head is characterized in that a thermal resistance enamel layer is arranged under a heating resistor, one end of each of electrode leads is provided with an auxiliary enamel layer under a lead pattern, and a complete substrate enamel layer is arranged under the heat resistance enamel layer and the auxiliary enamel layer. The manufacturing method comprises the steps of: adopting non-crystalline glaze slurry mixed with partial crystalline glaze slurry, making a substrate enamel layer on an insulation substrate, forming the heat resistance enamel layer and the auxiliary enamel layer on the substrate enamel layer, forming electrode leads on the substrate enamel layer, the heat resistance enamel layer and the auxiliary enamel layer, arranging the lead pattern on one end of each of the electrode leads, arranging the lead pattern on the auxiliary enamel layer, forming the heating resistor on the heat resistance enamel layer, and forming a protective layer on the heating resistor and at least one part of the electrode leads. The substrate enamel layer has poor flowability at a high temperature so that glaze structures of the heat resistance enamel layer and the auxiliary enamel layer do not appear, thus the temperature-sensitive printing head has the advantages of capability of increasing printing speed and improving printing quality, difficulty in generating lead breaking and short-circuiting problems by the electrode leads, and the like.
Description
technical field [0001] The invention relates to the technical field of printers, and specifically relates to a thermal printing head capable of increasing printing speed, improving printing quality, and making electrode wires less likely to be disconnected and short-circuited and a production method thereof. Background technique [0002] As we all know, in general, the thermal print head (thermal print head) and its production method are to use glaze slurry on the ceramic insulating substrate, and use the method of printing and sintering (hereinafter referred to as thick film method) to form a glaze layer on the insulating substrate. The electrode wires are formed on the glaze layer and the insulating substrate by means of spraying and plating, and several heating resistors usually arranged in a straight line are formed on the glaze layer by spraying. The glaze layer under the heating resistor is called a thermal resistance glaze layer. The protective layer formed on the hea...
Claims
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IPC IPC(8): B41J2/335
Inventor 王夕炜贺喆刘伟伟
Owner SHANDONG HUALING ELECTRONICS