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Electrical interconnect using embossed contacts on a flex circuit

A flexible circuit and flexible substrate technology, applied in the field of electrical interconnection, can solve the problem of expensive interconnection between driving circuits and transducers/actuators

Inactive Publication Date: 2012-01-11
XEROX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current approaches make the interconnection between drive circuits and transducers / actuators expensive and may not enable manufacturable and reliable interconnections at the desired increased density and reduced size

Method used

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  • Electrical interconnect using embossed contacts on a flex circuit
  • Electrical interconnect using embossed contacts on a flex circuit
  • Electrical interconnect using embossed contacts on a flex circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] figure 1 A cross-sectional view of a portion of the printhead 10 is shown. The part of the printhead shown here shows a nozzle stack 11 which typically consists of a series of brazed metal plates or a combination of metal plates with polymer or adhesive layers. As oriented in the figure, the nozzle or aperture plate will be located at the bottom of the nozzle stack 11 . A transducer array such as 12 is located on the surface of the nozzle stack opposite the nozzle plate, in this example the top of the nozzle stack 11 . The transducers are electrically connected to the drive circuit 18 by a conductive adhesive that is typically dispensed into holes in the standoff layer 14 . With increased orifice density and tighter spacing, the connection between the driver circuit and the orifice stack 11 becomes more difficult to maintain.

[0059] Some approaches have begun to use flexible circuit substrates, for example, by mounting driver chips on flexible circuits using techni...

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PUM

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Abstract

A print head has a jet stack having an array of jets, an array of transducers arranged on the jet stack such that each transducer corresponds to a jet in the array of jets, and a flexible circuit substrate arranged adjacent the array of transducers such that contact pads on the flexible circuit substrate make electrical connection to at least some of the array of transducers, the flexible circuit substrate being embossed so that the contact pads extend out of a plane of the flexible circuit substrate. A method of manufacturing a print head includes forming a jet stack having an array of jets, arranging an array of transducers on the jet stack such that each transducer in the array of transducers corresponds to each jet in the array of jets, embossing a flexible circuit substrate having contact pads such that the contact pads extend out of a plane of the flexible circuit substrate, and arranging the flexible circuit substrate such that the contact pads electrically connect to at least some of the transducers in the array of transducers.

Description

technical field [0001] The present invention relates to printhead design, and more particularly to electrical interconnections utilizing raised contacts on flex circuits. Background technique [0002] Current trends in printhead design involve increasing orifice packing density and orifice count while reducing the cost of the printhead. A "jet" also known as a nozzle, drop emitter or ejection port usually consists of an aperture or hole in a plate through which ink is drawn into the Expelled onto the printing surface. Higher density and higher count nozzles produce higher resolution and higher quality printed images. [0003] Each nozzle has a corresponding actuator, some kind of transducer that converts an electrical signal into a mechanical force that moves ink out of the nozzle. Electrical signals are typically generated from image data and a print controller that instructs which nozzles need to discharge ink during which intervals to form the desired image. Examples ...

Claims

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Application Information

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IPC IPC(8): B41J2/14
CPCB41J2/14201B41J2/14072B41J2/1632B41J2/1631B41J2/1601B41J2/1607B41J2002/14491B41J2/1634B41J2/1623Y10T29/49401B41J2/01
Inventor T·L·斯蒂芬斯D·L·马索普斯特J·R·安德鲁斯C·J·拉哈蒂
Owner XEROX CORP