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Aluminum nitride ceramic substrate 100W loading plate with impedance of 50 ohm

A technology of aluminum nitride ceramics and aluminum nitride substrates, used in electrical components, circuits, waveguide devices, etc., can solve problems such as equipment burnout and load burnout, and achieve good matching, wide application range, and good VSWR performance. Effect

Inactive Publication Date: 2012-01-18
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out.

Method used

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  • Aluminum nitride ceramic substrate 100W loading plate with impedance of 50 ohm
  • Aluminum nitride ceramic substrate 100W loading plate with impedance of 50 ohm

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Embodiment Construction

[0011] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] Such as figure 1 As shown, the impedance is 50Ω aluminum nitride ceramic substrate 100 watts load plate includes a 5.7*8.9*1.0mm aluminum nitride substrate 1, the back of the aluminum nitride substrate 1 is printed with a back conductive layer, the aluminum nitride substrate 1 Resistor 3 and wire 2 are printed on the front, wire 2 is connected to resistor 3 to form a load circuit, and the ground terminal of the load circuit is electrically connected to the back conductive layer through silver paste, so that the load circuit is grounded and conducted. The back conducting layer and wire 2 are printed with conductive silver paste, and the resistor 3 is printed with resistive paste. A glass protective film 4 is printed on the resistor 3 . The upper surface of lead wire 2 and glass protection film 4 is also printed with one deck black pro...

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Abstract

The invention discloses an aluminum nitride ceramic substrate 100W loading plate with the impedance of 50 ohm. The aluminum nitride ceramic substrate 100W loading plate comprises a 5.7*8.9*1.0mm aluminum nitride substrate, wherein a back conducting layer is printed on the back side of the aluminum nitride substrate; a resistor and a lead are printed on the front side of the aluminum nitride substrate; the lead is connected with the resistor to form a load circuit; the ground terminal of the load circuit is electrically connected with the back conducting layer; and a glass protecting film is printed on the resistor. The aluminum nitride ceramic substrate 100W loading plate with the impedance of 50 ohm of the structure has favorable VSWR (Voltage Standing Wave Ratio) performance; the power of the high-power aluminum nitride ceramic substrate loading plate on the 5.7*8.9*1.0mm aluminum nitride substrate reaches 100W; and meanwhile, the capacity of the high-power aluminum nitride ceramic substrate 100W loading plate is ensured to reach 3G, the power of the aluminum nitride ceramic substrate loading plate with the size is improved to be 100W on the premise of excellent performance, the service range of the aluminum nitride ceramic substrate with the size is wider and the aluminum nitride ceramic substrate with the size can be better matched with equipment.

Description

technical field [0001] The invention relates to a loading sheet of an aluminum nitride ceramic substrate, in particular to a 100-watt loading sheet of an aluminum nitride ceramic substrate with an impedance of 50Ω. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. At present, domestic aluminum nitride ceramic substrate load sheets are all used in the field of civil communication, and the frequency requirement of civil communication is 3G and within 3G. For the load chip, to be able to meet the requirements of the application, one needs to be able to meet the power requirements, and the other is the characteristics of the product, that is, the VSWR (standing wave ratio) should be as small as possible. The current market ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司