150W load plate of small-size high-power aluminium nitride ceramic substrate with grounded narrow edge

Abstract

The invention discloses a 150W load plate of a small-size high-power aluminium nitride ceramic substrate with a grounded narrow edge. The 150W load plate comprises an aluminium nitride substrate of which the size is 5.7*8.9*1mm, wherein a back guide layer is printed on the back surface of the aluminium nitride substrate; a resistor and a lead are printed on the front surface of the aluminium nitride substrate; the lead is connected to the resistor to form a load circuit; the grounded terminal of the load circuit is electrically connected with the back guide layer; and a glass protection film is printed on the resistor. The 150W load plate of the high-power aluminium nitride ceramic substrate with the grounded narrow edge is excellent in VSWR (voltage standing wave ratio) performance; the power on the aluminium nitride ceramic substrate with the size of 5.7*8.9*1mm is up to 150W, and simultaneously, the characteristic of the substrate is up to 3G; the power of the load plate of the aluminium nitride ceramic substrate with the size is improved to 150W on the promise that performance is excellent; and the use range of the aluminium nitride ceramic substrate with the size is wider and the aluminium nitride ceramic substrate with the size is well matched with a device.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate load sheet, in particular to a small-sized, high-power aluminum nitride ceramic substrate 150-watt load sheet with a narrow side grounded. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components, requiring the basic size to be smaller and smaller, while the power to be absorbed is getting larger and larger. [0003] At present, the domestic power can reach 150 watts. One kind of load chip is to use BeO material. This material is poisonous. It is easy to pollute the environment during the production proc...

AI Technical Summary

Problems solved by technology

[0003] At present, the domestic power can reach 150 watts. One kind of load chip is to use BeO material. This material is poisonous. It is easy to pollute the environment during the production process and bring certain harm to the health of production personnel.

The other is to use a larger size aluminum nitride substrate (substrate size is 6.35*9.55*1mm), this large size aluminum nitride substrate does not meet the miniaturization requirements of the current base station

At present, domestic aluminum nitride substrates can only make load sheets that can withstand 100W power in the size of 5.7*8.9*1mm

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