Aluminum nitride ceramic substrate 100W patch load film

A technology of aluminum nitride ceramics and aluminum nitride substrates, which is applied in the direction of electrical components, circuits, waveguide devices, etc., can solve the problems that the back conductive layer cannot completely have product contact, and the heat dissipation capacity is deteriorated, so as to change the manual welding method , Accelerate the process, and use a wide range of effects

Inactive Publication Date: 2012-01-18
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, some customers have adopted the SMT placement process, so that the back guide layer of the load sheet needs to leave a gap. After the placement is completed, the back guide layer cannot be completely in contact with the product, and the heat dissipation capacity will become poor.

Method used

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  • Aluminum nitride ceramic substrate 100W patch load film
  • Aluminum nitride ceramic substrate 100W patch load film

Examples

Experimental program
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Effect test

Embodiment Construction

[0011] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] Such as figure 1 As shown, the aluminum nitride ceramic substrate 100-watt patch-type load sheet includes an aluminum nitride substrate 1 of 6.35*6.35*1mm, and a separate back-conducting layer 6 is printed on the back of the aluminum nitride substrate 1, and the aluminum nitride substrate Resistor 3 and wire 2 are printed on the front of 1, wire 2 is connected to resistor 3 to form a load circuit, both ends of the load circuit are grounded 7 and the back conductive layer is electrically connected through silver paste, so that the load circuit is grounded and conducted. The back conducting layer and wire 2 are printed with conductive silver paste, and the resistor 3 is printed with resistive paste. A protective glass film 4 is printed on the resistor 3 . A layer of black protective film 5 is also printed on the upper surfaces of the w...

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Abstract

The invention discloses an aluminum nitride ceramic substrate 100W patch load film which comprises a 6.35*6.35*1mm aluminum nitride substrate; a back conductive layer is printed on the back side of the aluminum nitride substrate; a resistor and a lead are printed on the front side of the aluminum nitride substrate; the lead is connected with the resistor to form a load circuit; the grounding end of the load circuit is electrically connected with the back conductive layer; and a glass protective film is printed on the resistor. The aluminum nitride ceramic substrate 100W patch load film in the structure has good voltage standing wave ratio (VSWR), has 100W power on the 6.35*6.35*1mm aluminum nitride substrate, simultaneously the property reaches 3G, so that the aluminum nitride substrate with the size has a wider scope of application and can be better matched with equipment.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate load sheet, in particular to a 100-watt patch-type load sheet for an aluminum nitride ceramic substrate with a power of up to 100W, which can be used in the SMT field to enable clients to achieve high-speed patching and accelerate Process. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. , most of the load chip is welded to the customer's product by manual welding or reflow soldering process, and then the lead wire is welded to the pad of the load chip. The back conductive layer of the load chip in this process is a whole, welded to After the customer's product is installed, the entire back is completely consistent with the product, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司
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