High-power load sheet (150W) using aluminum nitride ceramic substrate

A technology of aluminum nitride ceramics and aluminum nitride substrates, used in electrical components, circuits, waveguide devices, etc., can solve problems such as equipment burnout and load burnout

Inactive Publication Date: 2012-02-22
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out.

Method used

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  • High-power load sheet (150W) using aluminum nitride ceramic substrate
  • High-power load sheet (150W) using aluminum nitride ceramic substrate

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Embodiment Construction

[0013] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] Such as figure 1 As shown, the 150-watt load chip of the high-power aluminum nitride ceramic substrate includes an aluminum nitride substrate 1 of 9.55*6.35*1.0mm. The resistor 3 and the wire 2 are printed, the wire 2 is connected to the resistor 3 to form a load circuit, and the ground end of the load circuit is electrically connected to the back conductive layer through the silver paste, so that the load circuit is grounded and conducted. The back conducting layer and wire 2 are printed with conductive silver paste, and the resistor 3 is printed with resistive paste. A glass protective film 4 is printed on the resistor 3 . A layer of black protective film 5 is also printed on the upper surfaces of the wires 2 and the glass protective film 4 .

[0015] The high-power aluminum nitride ceramic substrate 150 watt load chip of this str...

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PUM

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Abstract

The invention discloses a high-power load sheet (150W) using an aluminum nitride ceramic substrate. The high-power load sheet comprises the aluminum nitride substrate with the size of 9.55*6.35*1.0mm, wherein, a rear conductor layer is printed on the rear face of the aluminum nitride substrate; and resistors and leads are printed on the front face of the aluminum nitride substrate and are connected together to form a load circuit, a grounding terminal of the load circuit is electrically connected with the rear conductor layer, and glass protective films are printed on the resistors. By adopting the structure, the high-power load sheet (150W) using the aluminum nitride ceramic substrate has the advantages of good VSWR (Voltage Standing Wave Ratio) performance, high power up to 150W on the aluminum nitride ceramic substrate with the size of 9.55*6.35*1.0mm and good characteristics with high frequency band of 3G, thus the use range of the aluminum nitride ceramic substrate with the size is broadened and the high-power load sheet can be better matched with equipment.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate supporting sheet, in particular to a high-power aluminum nitride ceramic substrate supporting sheet of 150 watts. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. At present, domestic aluminum nitride ceramic substrate load sheets are all used in the field of civil communication, and the frequency requirement of civil communication is 3G and within 3G. For the load chip, to be able to meet the requirements of the application, one needs to be able to meet the power requirements, and the other is the characteristics of the product, that is, the VSWR (standing wave ratio) should be as small as possible. The current market foundation need...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/22
Inventor 郝敏
Owner 苏州市新诚氏通讯电子股份有限公司
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