1-3 type arch-shaped or circular ring piezoelectric composite material and preparing method thereof
A piezoelectric composite material and arc-shaped technology, which is applied in the selection of materials for piezoelectric devices or electrostrictive devices, the manufacture/assembly of piezoelectric/electrostrictive devices, and the selection of device materials, can solve piezoelectric The shape of the ceramic surface is not easy to control, and the polymer is difficult to fill, etc., to achieve the effect of increased preparation success rate, good product performance, and simple preparation process
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Embodiment 1
[0039] The cutting-casting process is used to prepare 1-3 arc-shaped piezoelectric composite materials, and the process flow chart is as follows figure 1 shown. Here, a semi-annular piezoelectric ceramic is used as an example of an arc-shaped piezoelectric ceramic. Cut the piezoelectric ceramic into two semicircles along the diameter of the pzt-4 piezoelectric ceramic ring (ie ring piezoelectric ceramic) with a diamond outer circle cutting dicing machine Ring, a 1-3 arc-shaped piezoelectric composite material is prepared from a piezoelectric ceramic semi-circular ring, and the volume fraction of the piezoelectric ceramic is 50.3wt%. The steps are as follows:
[0040] 1. Cut the ceramic along the axial direction of the piezoelectric ceramic semi-circle with a diamond outer circle cutting dicing machine. The width of the ceramic column is 2mm, and the base is 2mm, and a series of grooves are cut;
[0041] 2. Clean the material cut in step 1 in an ultrasonic cleaner, pour bisp...
Embodiment 2
[0048] The cutting-casting process is used to prepare 1-3 ring piezoelectric composite materials, and the process flow chart is as follows figure 2 shown. The piezoelectric ceramic ring used is a pzt-4 piezoelectric ceramic ring with a diameter of 51.00 mm × 20.00 mm × 1.70 mm, and the volume fraction of the piezoelectric ceramic is 50.3 wt%. The steps are as follows:
[0049] 1. Cut the ceramic along the axial direction of the piezoelectric ceramic ring with a diamond outer circle cutting dicing machine. The width of the ceramic column is 2mm, and the base is 2mm, and a series of grooves are cut;
[0050] 2. Clean the material cut in step 1 in an ultrasonic cleaner, pour bisphenol A epoxy resin and cure at room temperature for 24 hours;
[0051] 3. Fix the material obtained in step 2 on the base, make it move in the middle of the cutting process, and cut again along the direction perpendicular to step 1. This time the cutting does not leave the base, and the ceramic materi...
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