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Radiating device

A heat dissipation device and heat sink technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve problems such as damage to heating elements, and achieve the effect of avoiding damage

Inactive Publication Date: 2012-03-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing heat sinks are usually directly in close contact with heating elements, such as chips, and external forces impact the heat sink and easily cause damage to the heating elements

Method used

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  • Radiating device
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Experimental program
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other Embodiment approach

[0026] In other implementations, the buffer element 30 may be integrally formed with the bottom 21 of the radiator 20 .

[0027] When the heat dissipation device of the present invention is impacted by an external force, the buffer element 30 can act as a buffer to avoid damage to the heating element 100 .

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Abstract

The invention discloses a radiating device, which is used for the radiating of a heating element and comprises a radiator and a buffering element, wherein the radiator comprises a bottom part and a plurality of radiating fins, the buffering element is made of an elastic radiating material and comprises a first side board contacted with the heating element and a second side board contacted with the bottom part, and a buffering part is arranged between the first side board and the second side board. Compared with the prior art, the radiating device disclosed by the invention can carry out the buffering by utilizing the buffering element when being shocked by external force, and thus the heating element is prevented from being damaged.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] Existing heat sinks are usually in direct and close contact with heating elements, such as chips, and external forces impacting the heat sink may easily cause damage to the heating elements. Contents of the invention [0003] In view of the above, it is necessary to provide a heat dissipation device that is resistant to external shocks. [0004] A heat dissipation device is used for dissipating heat from a heating element. The heat dissipation device includes a radiator and a buffer element. The radiator includes a bottom and a plurality of heat dissipation fins. The buffer element is made of elastic heat dissipation material. The buffer element includes The first side plate is in contact with the heating element and the second side plate is in contact with the bottom of the radiator, wherein a buffer portion is provided between the first side plate and the second side...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/34
Inventor 官志彬
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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