electronic components

A technology for electronic components and components, applied in the field of Sn-plated electronic components, can solve problems such as easy to promote whisker generation, achieve excellent solder wettability and electrical conductivity, inhibit the production of whiskers, and inhibit the production of whiskers.

Inactive Publication Date: 2015-12-02
JST MFG CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a tendency to facilitate the generation of whiskers due to the influence of external force acting on the Sn plating layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • electronic components
  • electronic components
  • electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Hereinafter, modes for implementing the present invention will be described with reference to the drawings. In addition, in the description of this embodiment, the case where this invention is applied to the electronic component comprised as the terminal for connectors is demonstrated as an example, However, this invention can also be applied to other cases other than this example. That is, the present invention can be widely applied to electronic components having a Sn plated layer formed by covering Sn or a Sn alloy on the surface.

[0038] figure 1 It is a cross-sectional view showing a state where the connector terminal 1 configured as the electronic component in the present embodiment is mounted on the connector 100 . The connector 100 is configured, for example, as a connector for connecting ends of the flat cable 101 . It should be noted, figure 1 A section perpendicular to the width direction of the connector 100 is shown. In addition, in figure 1 In , the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
Login to view more

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part in which solder wettability and conductivity are ensured, and even when external force acts on a Sn plated layer, occurrence of a whisker can be suppressed. SOLUTION: The electronic part 1 includes a body part 11 formed from a metallic material, an undercoat layer 12 covering the surface of the body part 11, and a Sn plated layer 13 formed by covering the undercoat layer 12 with Sn or a Sn alloy. The undercoat layer 12 at least has a Ni-B plated layer 15 formed by covering the surface of the body part 11 with a Ni-B alloy or a Ni-P plated layer 16 formed by covering the surface of the body part 11 with a Ni-P alloy. The average dimension of the thickness dimension Tsn of the Sn plated layer is set in a range of 0.2 μm or more and 0.6 μm or less. COPYRIGHT: (C)2012,JPO&INPIT

Description

technical field [0001] The present invention relates to an electronic component having a Sn plated layer formed by covering Sn or a Sn alloy on its surface. Background technique [0002] In view of the RoHS Directive initiated by Europe that prohibits the use of Pb (lead) in principle and the demand for reducing environmental burdens, in recent years, in electronic components, as a material for plating, existing materials containing Pb (lead) have been replaced, and A lead-free material mainly composed of Sn (tin) or a Sn alloy is used. However, when a Sn-plated layer covering Sn or a Sn alloy is formed on the surface of an electronic component, needle-like crystals called whiskers are generated, and there is a problem that an electrical short circuit is likely to be induced. [0003] On the other hand, by forming a gold-plated layer instead of the Sn-plated layer on the surface of the electronic component, the problem of generation of whiskers can be avoided. However, sin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/03H01R12/77C23C28/02C23C18/32C25D3/30
Inventor 雨宫直人
Owner JST MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap