Electronic part

A technology for electronic components and components, applied in the field of Sn-coated electronic components, can solve the problems of easily promoting whisker generation, achieve excellent solder wettability and conductivity, suppress whisker generation, solder wettability and conductivity improved effect

Inactive Publication Date: 2012-03-28
JST MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, there is a tendency to facilitate the generation of whiskers due to the influence of external force acting on the Sn plating layer

Method used

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Embodiment Construction

[0037] Hereinafter, modes for implementing the present invention will be described with reference to the drawings. In addition, in the description of this embodiment, the case where this invention is applied to the electronic component comprised as the terminal for connectors is demonstrated as an example, However, this invention can also be applied to other cases other than this example. That is, the present invention can be widely applied to electronic components having a Sn plated layer formed by covering Sn or a Sn alloy on the surface.

[0038] figure 1 It is a cross-sectional view showing a state where the connector terminal 1 configured as the electronic component in the present embodiment is mounted on the connector 100 . The connector 100 is configured, for example, as a connector for connecting ends of the flat cable 101 . It should be noted, figure 1 A section perpendicular to the width direction of the connector 100 is shown. In addition, in figure 1 In , the ...

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Abstract

The present invention provides an electronic part which can ensure wettability and conductivity of solder. Generation of crystal whisker can be prevented even an external force is applied on a Sn coating. As a settlement solution, the electronic part (1) is provided with the following components: a body part (11) which is made of metal material; a bottom coating layer (12) which covers the surface of the body part (11); and a Sn coating (13) which is formed through Sn or Sn alloy on the bottom coating layer (12). The bottom coating layer (12) has at least one coating selected from Ni-B coating (15) which is formed through covering the Ni-B alloy and Ni-P coating (16) that is formed through covering Ni-P alloy. Average dimension of the thickness dimension (Tsn) of the Sn coating is set to a range between 0.2 mu m and 0.6 mu m.

Description

technical field [0001] The present invention relates to an electronic component having a Sn plated layer formed by covering Sn or a Sn alloy on its surface. Background technique [0002] In view of the RoHS Directive initiated by Europe that prohibits the use of Pb (lead) in principle and the demand for reducing environmental burdens, in recent years, in electronic components, as a material for plating, existing materials containing Pb (lead) have been replaced, and A lead-free material mainly composed of Sn (tin) or a Sn alloy is used. However, when a Sn-plated layer covering Sn or a Sn alloy is formed on the surface of an electronic component, needle-like crystals called whiskers are generated, and there is a problem that an electrical short circuit is likely to be induced. [0003] On the other hand, by forming a gold-plated layer instead of the Sn-plated layer on the surface of the electronic component, the problem of generation of whiskers can be avoided. However, sin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/03H01R12/77C23C28/02C23C18/32C25D3/30
Inventor 雨宫直人
Owner JST MFG CO LTD
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