Vacuum pumping device and method for circuit board

Abstract

The embodiment of the invention discloses a vacuum pumping device and a method for a circuit board. The device comprises a bracket (201), a glass frame (204), a sealing rubber ring (205), and gas guide strips (206), wherein grooves (207) are formed on the surfaces of the gas guide strips (206); difference value between the sum of the thickness of a circuit board (202) placed between the bracket (201) and the glass frame (204) and that of a bottom plate (203), and the thickness of the gas guide strips (206) is larger than or equal to zero, and is within a preset value; the gas guide strips (206) are located in a cavity between the bracket (201) and the glass frame (204); the sealing rubber ring (205) is used for sealing the cavity between the bracket (201) and the glass frame (204); and anair exhaust outlet (209) formed on the vacuum pumping device is communicated with the grooves (207) formed on the gas guide strips (206). The invention can improve the vacuum pumping effect and the product yield of the PCB.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a device and method for vacuuming a circuit board. Background technique [0002] The packaging substrate is a printed circuit board (Printed Circuit Board, PCB) dedicated to chip packaging. The substrate can provide the chip with electrical connection, protection, support, heat dissipation, assembly and other functions to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization. The packaging substrate is a kind of circuit board, and the embodiment of the present invention will be described as an example. The circuit board can also be: a printed circuit board, a flexible circuit board, etc.; therefore, the packaging substrate is not limited to the application scope of the embodiment of the present invention. For example, the example of the packaging substrat...

AI Technical Summary

Problems solved by technology

[0010] However, if the exposure disk is larger than the size of the plate, the air pressure in the cavity inside the exposure disk will become lower after the air is drawn out, causing the atmospheric pressure on the outer surface of the glass frame to be much greater than the pressure on the inner surface of the glass frame, so the glass frame will Deformation, leading to poor vacuuming. In addition, in the exposure step, due to the refraction of ultraviolet light caused by poor vacuuming, pattern distortion (ie exposure) will occur, which will lead to under-corrosion and short circuit phenomena at the edge of the board after the etching step is performed. Therefore, the yield rate of PCB products is low

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