94results about How to "Eliminate bad" patented technology

General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.

New fluids are disclosed for use in servicing subterranean formations containing oil and gas. In particular, an improved chemical gelling additive for hydrocarbon based fracturing fluids is disclosed having reduce, negligible or no volatile phosphorus at temperatures below about 250° C.

The disclosed sulfur recovery system and process avoid some of the operational problems of conventional Claus plants and processes by replacing the reaction burner and furnace tube of a conventional Claus plant with a more efficient short contact time catalytic reactor assembly containing a SPOC™ catalyst that operates efficiently at elevated temperatures. Such Claus plant modification also reduces or avoids the negative effects of hydrocarbons, CO₂ and ammonia in Claus sulfur plant feeds, and permits efficient processing of dilute to concentrated H₂S feeds. The disclosed modification makes possible the expansion of Claus plant capacity at lower cost.

General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.

The invention relates to an insert feeding device and method. The device comprises a discharge unit and a feeding unit, wherein the discharge unit comprises a vibration plate, a linear vibrator, a material wait hole, a first detection optical fiber, a first cylinder and a second detection optical fiber; one end of the linear vibrator is fixedly connected with a discharge hole of the vibration plate, and the other end of the linear vibrator is connected with the material wait hole; the vibration plate is provided with a distribution strip for preventing an insert from being reversely arranged; the first detection optical fiber is arranged at the material wait hole and is used for detecting whether the insert exists or not; the first cylinder is arranged under the material wait hole; the second detection optical fiber is arranged at the upper side of the material wait hole and is used for detecting whether the insert is lifted or not; the feeding unit comprises a fixed plate, and two guide locating ejector pins, two grabbing mechanisms and two suction cups which are arranged on the fixed plate; the guide locating ejector pins can be inserted into locating holes of a mould and are used for guiding and locating the fixed plate; the grabbing mechanisms are used for grabbing the insert from the material wait hole; the suction cups are used for absorbing a product in which the insert is installed. After the device and the method are adopted, the insert can be automatically fed and is prevented from being reversely installed.

A linear, horizontal conveyor device for containers which are equipped with a collar at the base of the neck thereof. The invention includes two conveyors including endless links, which are each equipped with two parallel, mobile lines which face one another and which are driven in the same direction and at the same speed. The aforementioned lines are separated from one another by a distance that is greater than the diameter of the body of the containers and less than the diameter of the collars thereof. At least one conveyor includes a short segment that can be moved transversely outwards, such that the space between the two facing lines becomes greater than the diameter of the collar and the container falls.

The invention discloses an induction brazing welding method for a metal part. The method utilizes induction brazing welding equipment and then is implemented according to the following steps of: a step 1 of selecting the induction brazing welding equipment and determining related parameters; a step 2 of carrying out weldment surface processing, i.e. roughening the welding surface of a weldment, processing the metal-plated surface of the weldment, carrying out matched selection between the weldment and a soldering flux, a brazing filler metal, a welding temperature and a brazing clearance and selecting each process parameter of induction brazing; a step 3 of assembling and fixing the weldment; and a step 4 of implementing welding. According to the induction brazing welding method disclosed by the invention, the induction welding and the induction brazing welding of structures of different materials, pipe fittings, sheets, tube plates and the like are implemented, the sealing performance of a weld joint is improved, the intensity of the weld joint is reduced, the electrical conductivity is obviously improved, and the weld joint has a reliable quality.

The present invention can facilitate mobility of fluid in a solenoid valve when opening and shutting the valve by separating and connecting a valve body with respect to a valve seat with magnetic force of a solenoid coil. The solenoid valve is provided with a valve main part 1, the solenoid coil 2, a suctioner 3, the valve body 4, a plunger 5 connecting with the valve body 4, a valve-seat sheet member 6 forming the valve seat 61, and a coil spring 7 arranged between the suctioner 3 and the plunger 5. When electricity is applied to the solenoid coil 2, a magnetic force caused by electric conduction of the solenoid coil 2 is generated on the suctioner 3, and the plunger 5 moves toward the suctioner 3 while resisting to urging force of the coil spring 7. The valve body 4 moves toward the valve seat 61 of the valve-seat sheet member 6 together with the plunger 5, the valve body 4 is firmly touched with the valve seat 61 of the valve-seat sheet member 6, and the solenoid valve performs a closing-valve operation. A clearance 17 is formed between a pipe portion 15 and the suctioner 3, and caulked portions 20 are provided in a plurality of places by caulking so as to maintain the clearance.

The invention discloses an electronic seal, which comprises a pin, a pin seat, an antenna and an RFID (radio frequency identification) chip, wherein the pin can penetrate into the pin seat but cannot retreat from the pin seat, the antenna is mounted on the pin seat, and the RFID chip can be matched with the antenna. The pin seat is provided with a shaft hole axially recessed and a demoulding groove radially communicated with the bottom end of the shaft hole, the pin can penetrate into the shaft hole, a spring sheet is integrally formed in the demoulding groove, the top surface of the spring sheet is positioned below the shaft hole, the antenna is combined to the pin seat and the top surface of the spring sheet by the aid of a pasting layer, so that the antenna and the RFID chip can be in stable electric connection by the aid of the restoring force of the spring sheet after the pin penetrates into the shaft hole but cannot retreat from the shaft hole, the electric connection can be cut off, and a recognition host mounted in a customhouse can achieve the functions of rapid recognition and container management. As the spring sheet is integrally formed in the pin seat, assembly efficiency can be greatly improved, and production cost can be greatly reduced.

A generator is provided comprising a rotor with a number of magnetic rotor pole shoes, a stator with a number of stator coils wound on the stator, and a generator-utility grid interface comprising a plurality of diode rectifiers, each diode rectifier is connected to a stator coil and the number of stator coils is greater than the number of rotor pole shoes, or the number M of rotor pole shoes is greater than, but not an integer multiple of, the number of stator coils. A wind turbine utilizing the generator of the present invention and a method of assembling such a generator are provided

The invention discloses a touch display panel and a display apparatus. Lead terminals corresponding to pins of a touch driving chip in the touch display panel are arranged in a matrix, and at least one second terminal corresponding to a touch signal line is arranged in each row or column of the lead terminals, so that first terminals corresponding to data lines and the second terminals corresponding to the touch signal lines are arranged in a mixed way, and leads corresponding to the data signal lines and leads corresponding to the touch signal lines are arranged on a same layer. Compared with the prior art, a layer of metal and a corresponding fabrication process do not need to be additionally added for fabricating the leads corresponding to the touch signal lines separately, so that the fabrication cost can be reduced; and meanwhile, the problems of various bad phenomena and relatively large occupied space of wiring caused by additional metal routing can be solved, so that the product yield is increased.

The present invention provides a method for preparing cooling plate of printed circuit. Firstly a double layer metal cooling plate compounding aluminum and copper is firstly prepared, wherein the cooling plate is etched with a wiring circuit pattern on the surface of copper layer. Then the cooling plate is fixed on a platform with a vacuum absorption mode. The platform is installed on a processor and is provided with a positioning structure for locating the cooling plate. The limiting of main shaft of processor has high cutting torsion and strong structural property compared with the known PCB processing special machine. The main shaft can execute cutting to the cooling plate on the platform after assembling the cutter. Simultaneously the cutting position can be executed with temperature dropping and chip removal with a mode of forced cooling for quickly completing the procession of a high-quality cooling plate.

The invention provides a method for photoetching of an LED wafer without a mask plate. The method makes good use of the light-proof characteristics of metal electrodes, carries out exposure on negative photoresist from the back face of the substrate of the LED wafer, achieves accurate self-aligned photoetching, and overcomes the defects that SiO2 above the electrodes cannot be etched off completely due to the fact that the alignment accuracy of a photoetching machine is insufficient in a traditional SiO2 layer trepanning technology, a SiO2 layer is made to be tightly connected with the electrodes, the SiO2 on the electrodes is completely eradicated from falling off, and therefore the problem that wires cannot be bonded in follow-up wire bonding is solved. In addition, according to the method, only a simple photoetching machine is needed, no photoetching plate is needed, the expensive cost of photoetching machine devices and photoetching plates is saved, poor products caused by alignment errors are eliminated, working efficiency is improved, and the SiO2 trepanning manufacturing cost in the manufacturing process of LED chips is reduced greatly.

The invention discloses an electronic sealing strip. The electronic sealing strip comprises a lock rod, a circuit board, a lock head into which the lock rod can be inserted, and an antenna which can be matched with a radio frequency identification (RFID) chip, wherein the lock rod is provided with an accommodating chamber which passes through a bottom surface; the circuit board is fixedly arranged in the accommodating chamber and is provided with a printed circuit and the RFID chip arranged in the printed circuit; the lock head is provided with a buckling device which ensures that the lock rod cannot retreat; the antenna is arranged in the lock head; when the lock rod is inserted into the lock head, the antenna, the printed circuit and the RFID chip are in electric connection directly; and when the lock rod is cut off, the electric connection is interrupted, so that an identification host arranged in customs can have the function of quickly identifying and managing containers. The electronic sealing strip with the structure has economic benefits and can effectively overcome the defects that the cost is soaring and the quality cannot be improved in the conventional electronic sealing strip.

The invention discloses a pressure-changeable inflator capable of being fast switched. According to the inflator, a movable air cylinder with a cylinder hole is provided with a rear end cover for forming a rear air chamber between the cylinder hole and the rear end cover, the rear end cover is provided with a pressure release hole communicating with the interior and the exterior of the rear air chamber, a switch valve capable of opening and closing the pressure release hole is arranged, and therefore when the pressure release hole is opened, second-section pressurization air supply of the rear air chamber can be eliminated, and the inflator can be applied in a common low-pressure inflation mode. The problems that the structure is complex, assembly consumes a lot of time and control is difficult can be solved.

The invention relates to the technical field of production equipment, and particularly discloses a synchronous precise rolling device of a rolled slitter edge of a metal plate. The synchronous precise rolling device comprises a rack, a power plant, a driving device, a rolling device, a position detection device and a steering roller, wherein the power plant, the rolling device and the driving device are respectively installed on the rack; the position detection device is composed of a position detection head and a swinging bracket; the position detection head is composed of a precision potentiometer, a driving gear, a rotating shaft and a bearing seat of the rotating shaft, the rotating shaft and the bearing seat of the rotating shaft are fixed together with the rack through seat plates, the position detection head is connected with the swinging bracket through the rotating shaft, a pulley is installed on the end of the swinging bracket, the rolled slitter edge enters the rolling device through a pulley groove and the steering roller, so as to be rolled, and the rolling device is driven to rotate by the driving device. When the slitter edge rolling speed of the device changes, a motor is regulated by the device according to an output signal of the precision potentiometer, so as to change the slitter edge speed to adapt to the whole line speed, and the condition that the whole line is shut down due to breaking or accumulation of the slitter edge is avoided.