Production method for printed circuit heat radiation board
A technology of printed circuit and heat sink, applied in the field of manufacturing method of printed circuit heat sink, can solve the problems of fast tool wear, inconsistent with the needs of video and audio data data operation, slow processing speed, etc., so as to achieve slow tool wear and better chip removal effect. Excellent, fast processing effect
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[0046] The present invention relates to a method for manufacturing a printed circuit cooling plate, please refer to Figure 4 Promptly propose the present invention is different from the conventional manufacturing process below, comprises:
[0047] 1. Prepare a composite metal heat sink; Figure 5 As shown, the present invention adopts a metal heat dissipation plate 30 composed of aluminum and copper plates up and down. The aluminum layer 31 of the heat dissipation plate 30 has better heat dissipation and heat resistance effects. As for the surface of the copper layer 32, a wiring circuit pattern 33 is etched. ;
[0048] 2. Vacuum absorb the cooling plate to a carrier with a positioning structure; Figure 5 to Figure 8 As shown, the carrier 40 has a flow channel 41 vertically and horizontally recessed on the top surface, and a leak-proof gasket 42 with a protruding surface is sunk outside the range of the flow channel 41, and then made of acrylic or other plastics. The jig ...
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