Unlock instant, AI-driven research and patent intelligence for your innovation.

Light emitting diode combination

A light-emitting diode and light-emitting chip technology, applied in the field of diodes, can solve problems such as inability to achieve uniform light emission, discontinuous bright spots, and affecting the overall appearance of the module

Active Publication Date: 2012-04-18
佛山百旺电器有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light emitting diodes of the existing light emitting diode modules are usually arranged on the circuit board at a certain interval, resulting in multiple discontinuous bright spots seen from the front, and the effect of uniform light emission cannot be achieved.
Moreover, these bright spots are likely to cause glare and affect the overall appearance of the module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode combination
  • Light emitting diode combination
  • Light emitting diode combination

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] see Figure 1-2 , shows the LED combination of the present invention. The LED combination includes a heat dissipation substrate 10 and a plurality of LEDs 20 placed on the substrate 10 . The substrate 10 can be made of metal materials with high thermal conductivity such as copper and aluminum, so as to accelerate the heat dissipation of the LEDs 20 . The LEDs 20 are connected in series to form a strip-shaped module.

[0044] Please also refer to Figure 3-4 , each light-emitting diode 20 includes a base 30, a first pin 40 and a second pin 50 pierced in the base 30, a light-emitting chip 60 fixed on the base 30, and a packaged light emitting diode Package 70 of chip 60 . The base 30 is made of insulating materials such as plastics and ceramics. Preferably, in order to enhance the heat dissipation of the light emitting diodes 20, the material of the base 30 can be selected as ceramics. The base 30 includes a rectangular supporting portion 32 and a first step 34 and a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a light emitting diode combination which comprises a plurality of light emitting diodes, wherein each light emitting diode comprises a base, a light emitting chip fixed on the base, a pin penetratively arranged in the base and a package body covering the light emitting chip, wherein the pins of adjacent light emitting diodes are electrically connected; and the bases of adjacent light emitting diodes are mutually abutted. The light emitting diode combination disclosed by the invention can form a continuous light strip, thereby avoiding glare.

Description

technical field [0001] The invention relates to a diode, in particular to a combination of light emitting diodes. Background technique [0002] Light-emitting diodes have been used in more and more occasions due to their advantages of high light efficiency, low energy consumption, and no pollution, and have a tendency to replace traditional light sources. [0003] Existing LED modules are usually composed of a circuit board and a plurality of LEDs fixed on the circuit board. The pins of each light emitting diode are fixed on the conductive track of the circuit board by welding to realize the electrical connection with the circuit board, and the bases of each light emitting diode are fixed on the mounting position of the circuit board by welding to realize the mechanical connection with the circuit board. However, the light emitting diodes of the existing light emitting diode module are usually arranged on the circuit board at a certain interval, resulting in a plurality of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/03H01L33/48
CPCH01L25/0753H01L33/486F21K9/00H01L33/62H01L2224/48091F21Y2103/003F21Y2101/02H01L33/54F21Y2103/10F21Y2115/10H01L2924/00014
Inventor 詹勋伟柯志勋
Owner 佛山百旺电器有限公司