Glass ring sensor packaging structure

A technology of packaging structure and glass ring, which is applied in the direction of instruments, measuring devices, measuring fluid pressure, etc., can solve the problems of internal stress release and achieve the effect of state stability

Active Publication Date: 2012-04-25
JIANGSU AOLIWEI SENSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a glass ring sensor packaging structure to solve the problem of internal stress release during low temperature operation of sensors in the prior art after high temperature electrostatic packaging and sintering

Method used

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  • Glass ring sensor packaging structure
  • Glass ring sensor packaging structure

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Embodiment Construction

[0008] Such as figure 1 As shown, the glass ring sensor packaging structure of the present invention includes a base 1 for packaging the sensor body, a circular groove 3 is arranged on the outer surface of the sensor base 1, and a circular groove 3 is arranged in the circular groove 3. Glass ring 2, the glass ring 2 is embedded in the ring cutting groove 3, and the whole of the glass ring 2 is buried in the lower part of the outer surface of the base 1, so that the glass ring 2 can be guaranteed to be in the normal use state It can ensure that the glass ring 2 only plays the role of stress evacuation or support for the base itself; the ring cutting groove 3 and the glass ring 2 are interference Cooperate so that the glass ring 2 can evenly evacuate the stress of the base 1 itself, so that the base 1 will not shrink or expand excessively during the process of being cold or heated, and ensure that the sensor body inside the base 1 is in a stable state and will not be affected by...

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Abstract

The invention discloses a glass ring sensor packaging structure, which comprises a pedestal for packaging a sensor body, wherein the outer surface of a shell of the sensor pedestal is provided with a ring-cut groove in which a glass ring is arranged; the glass ring is arranged in the ring-cut groove in an embedding mode and is integrally buried in the lower part of the outer surface of the pedestal; the ring-cut groove is in interference fit with the glass ring, so that the glass ring can uniformly release the stress of the pedestal itself; and therefore, the pedestal is not over-shrunk or over-expanded in a cooling or heating process, the state of the sensor body in the pedestal is guaranteed to be stable, and the problem of failure or damage of the sensor body is not caused due to influence of external force.

Description

technical field [0001] The invention relates to a pressure sensor structure, in particular to a glass ring sensor packaging structure. Background technique [0002] After the sensor is electrostatically packaged and sintered at high temperature, the internal stress at low temperature will have a great impact on the accuracy, stability and sensitivity of the sensor, so the release of internal stress is the stability and reliability of the pressure and liquid level sensor when it works in an ultra-low temperature environment. Sexual key technology. Contents of the invention [0003] The purpose of the present invention is to provide a glass ring sensor package structure, which solves the problem of internal stress release when the sensor is operated at low temperature after high temperature electrostatic package and sintering in the prior art. [0004] The purpose of the present invention is to realize through the following technical solutions: [0005] The packaging struc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/14
Inventor 赵山华叶鹏周怡王亚斌程绍龙范传东
Owner JIANGSU AOLIWEI SENSING TECH
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