Method for bonding optical substrate and carrier plate and process for manufacturing soft substrate by method

A flexible substrate and optical technology, used in chemical instruments and methods, semiconductor/solid-state device manufacturing, lamination devices, etc., can solve problems such as yield decline, affecting process, and reduce equipment costs and production costs.

Inactive Publication Date: 2012-05-16
ALLIANCE MATERIAL
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, due to the large expansion coefficient of the PET material used in this double-sided tape, it is easy to be warped and deformed by heat, which will affect the subsequent process and lead to a decrease in yield.

Method used

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  • Method for bonding optical substrate and carrier plate and process for manufacturing soft substrate by method
  • Method for bonding optical substrate and carrier plate and process for manufacturing soft substrate by method
  • Method for bonding optical substrate and carrier plate and process for manufacturing soft substrate by method

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Embodiment Construction

[0032] In order to enable your examiner to clearly understand the content of the present invention, the following descriptions are provided together with the drawings, please refer to them.

[0033] see Figure 5 As shown, it is a flowchart of a preferred embodiment of the method for laminating an optical substrate and a carrier plate according to the present invention, which includes the following steps

[0034] S11: Provide an optical substrate.

[0035] S12: Provide a solid silica gel layer, which has an electrostatic adsorption force.

[0036] S13: disposing the solid silica gel layer on the optical substrate by electrostatic adsorption.

[0037] S14: Provide a carrier board.

[0038] S15: placing the carrier plate on the solid silica gel layer by electrostatic adsorption.

[0039] Please also refer to Figure 6 , which is a schematic diagram of a preferred embodiment of the method for laminating an optical substrate and a carrier in the present invention.

[0040] T...

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PUM

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Abstract

The invention provides a method for bonding an optical substrate and a carrier plate and a process for manufacturing a soft substrate by the method. The method for bonding the optical substrate and the carrier plate comprises the following steps of: providing the optical substrate; providing a solid silica gel layer with electrostatic adsorption force; arranging the solid silica gel layer on the optical substrate by using the electrostatic adsorption force; and providing the carrier plate, and arranging the carrier plate on the solid silica gel layer by using the electrostatic adsorption force. Therefore, the optical substrate and the carrier plate can be bonded in a baking-free mode, so that the subsequent manufacturing process is facilitated.

Description

technical field [0001] The present invention relates to a method for bonding an optical substrate and a carrier and a flexible substrate manufacturing process using the method, in particular to a method for bonding an optical substrate and a carrier that can improve yield and reduce production costs and use the method method of flexible substrate manufacturing. Background technique [0002] Generally speaking, in the manufacturing process of the flexible substrate, a carrier made of glass or plastic is used for processing or transportation. However, in the prior art, the surface of the substrate is coated with silica gel, baked and dried, and then attached to the carrier, so as to facilitate the substrate to perform multi-layer structure manufacturing processes, such as color filters (color filter), thin film crystal array panels. (TFT array) or touch sensor (Touch sensor) and other back-end processes. The main function of the carrier is to serve as a carrier in the back-e...

Claims

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Application Information

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IPC IPC(8): B32B37/00B32B38/10H01L21/02
Inventor 黄启华
Owner ALLIANCE MATERIAL
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