Chemical mechanical grinding device

Abstract

The invention discloses a chemical mechanical grinding device, comprising a grinding mechanism, a carrying mechanism and a rotating mechanism connected with the carrying mechanism. The rotating mechanism comprises a driver, the carrying mechanism at least comprises a rotating bearing, and the rotating bearing is a magnetic suspension bearing. In the chemical mechanical grinding device disclosed by the invention, the magnetic suspension bearing is mainly taken as a grinding pad bearing, and a grinding pad is suspended above the magnetic suspension bearing by virtue of magnetic suspension force, thus no mechanical contact is arranged between the grinding pad and the magnetic suspension bearing. The invention aims at applying the magnetic suspension bearing technology to the semiconductor technology industry, so as to substitute the traditional mechanical bearing, thus defects caused by the fact that the mechanical bearing is used, such as mechanical friction loss, energy loss, oil pollution, noise and the like can be overcome. Besides, the magnetic suspension bearing provided by the invention also has the advantages that service life is longer compared with the mechanical bearing and loss caused by wafer scrapping owning to bearing problem is greatly reduced.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a chemical mechanical grinding device. Background technique [0002] With the rapid development of ULSI (Ultra Large Scale Integration), the manufacturing process of integrated circuits has become more and more complex and sophisticated. In order to improve integration and reduce manufacturing costs, the feature size of components (Feature Size) continues to decrease, and the number of components per unit area of ​​the chip continues to increase. It is difficult for planar wiring to meet the requirements of high-density distribution of components, and only multi-layer wiring technology can be used. The vertical space of the chip is utilized to further increase the integration density of the device. However, the application of multilayer wiring technology will cause the surface of the substrate to be uneven, which is extremely unfavorable for graphics production. For this ...

AI Technical Summary

Problems solved by technology

When friction occurs, it often causes wear of mechanical parts, energy loss during machine operation, and often makes noise, and when severe friction occurs, the product to be ground (such as a wafer, etc.) may also fall off, and cause scrap

This will not only affect the efficiency of process manufacturing, but also bring a lot of financial and time loss

[0006] Therefore, engineers in the field of semiconductor technology hope to develop a bearing to replace the existing mechanical bearing, so that the above problems can be improved, but there is no better solution at present.

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