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X-ray diffraction oriented cutting method for wire cutting crystal
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A cutting method and X-ray technology, applied in the field of directional cutting, can solve the problem of high cost of matching directional cutting devices, and achieve the effects of simple and easy operation, improved work efficiency, and reduced equipment costs
Active Publication Date: 2014-05-28
峨嵋半导体材料研究所
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Problems solved by technology
Due to the extremely high cost of the supporting directional cutting device, whether the existing independent directional equipment can be used to realize the directional cutting on the crystal wire cutting machine, and it can be achieved that multiple wire cutting machines and internal circle cutting machines share a set of directional equipment, will become a reality. problem to be solved
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Embodiment 1
[0020] A wire-cut crystal X-ray diffraction directional cutting method, comprising the following steps in sequence:
[0021] A) Rotate the crystal 1 placed on the platform of the X-ray diffractometer to find and determine the 0° diffraction angle, keep the crystal 1 still after confirming, and draw a horizontal axis Z at the center of the crystal end face 11, this axis is the bonding axis Z ;
[0022] B) if figure 1 As shown, after measuring the deviation angle α of the crystal direction perpendicular to the bonding axis Z, the deviation degree α=3° is obtained, and the radius line 2 and the deviation degree 3° mark are drawn on the crystal end face 11 in this direction, and then the crystal is rotated by 1 When the bonding axis Z is vertical, it can be determined that its deviation direction relative to the bonding axis Z is to the right, such as image 3 shown;
[0023] C) if image 3 As shown, first, the crystal 1 is vertically bonded to the cuboid cut-through layer 3 i...
Embodiment 2
[0025] A wire-cut crystal X-ray diffraction directional cutting method, comprising the following steps in sequence:
[0026] A) Rotate the crystal 1 placed on the platform of the X-ray diffractometer to find and determine the diffraction angle of 0°. After confirmation, keep the crystal 1 still and draw a horizontal axis Z at the center of the crystal end face 11. This axis is the bonding axis Z ;
[0027] B) if Figure 4 As shown, after measuring the deviation angle α of the crystal direction perpendicular to the bonding axis Z, the deviation degree α=3° is obtained, and the radius line 2 and the deviation degree 3° mark are drawn on the crystal end face 11 in this direction, and then the crystal is rotated by 1 When the bonding axis Z is vertical, it can be determined that its deviation direction relative to the bonding axis Z is leftward;
[0028] C) if Figure 5 As shown, first, the crystal 1 is vertically bonded to the cuboid cut-through layer 3 in the direction of the...
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Abstract
The invention discloses an X-ray diffraction oriented cutting method for a wire cutting crystal and belongs to the field of crystal processing. The X-ray diffraction oriented cutting method comprises the following steps of: rotating a crystal arranged on an X-ray diffraction instrument platform for finding to determine a 0-degree diffraction angle; after determination, keeping the crystal unmovable and making a horizontal axis Z at the position of the end face of the crystal, which passes through the center, wherein the horizontal axis Z is a bonding shaft Z; measuring a crystal orientation deviation angle alpha in a direction perpendicular to the bonding shaft Z; determining a lateral deviation direction relative to the bonding shaft Z and marking the lateral deviation direction; setting a horizontal straight line as a standard line and keeping the vertical direction of the bonding shaft Z, wherein a central axis of the crystal is positioned at the left / right side according to the lateral deviation direction; adjusting a horizontal included angle alpha between the central axis of the crystal and the standard line; and fixing the crystal and carrying machining cutting along the direction of the standard line. The invention provides an oriented cutting method. According to the direction cutting method, a plurality of wire cutting machines and inner circle cutting machines can share one set of direction equipment by using a traditional X-ray diffraction orientating instrument, thus expenses of the equipment are greatly reduced.
Description
technical field [0001] The invention belongs to the field of crystal processing, in particular to a directional cutting method. Background technique [0002] The wire cutting orientation is different from the inner circle cutting orientation. The inner circle cutting orientation can be adjusted in two dimensions in the vertical and horizontal directions, while the wire cutting orientation can only be adjusted in the horizontal direction, and it cannot be retested after cutting the head piece, especially It is a crystal with relatively high requirements on the crystal orientation, which is prone to errors and deviations, and the deviation of the crystal orientation beyond the requirements will cause the entire crystal to be scrapped. For this reason, wire cutting machine manufacturers equip each wire cutting machine with special orientation and adjustment equipment (the price is as high as about 300,000 US dollars), which can measure and adjust the crystal orientation deviati...
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Application Information
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