Composite inorganic fireproof board and preparation method for same

An inorganic fireproof board and inorganic adhesive technology, applied in fire prevention, building components, building materials and other directions, can solve the problems of not complying with energy saving and emission reduction, increase the weight of the board, increase the thickness and density, etc. Simple preparation process and high compressive strength

Inactive Publication Date: 2012-06-27
NG TERASUN AIR DUCT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Increasing the thickness and density will increase the weight of the board, and then increase the performance of supporting this type of board. The requirements for the support are higher, which does not meet the requirements of energy saving and emission reduction.

Method used

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  • Composite inorganic fireproof board and preparation method for same
  • Composite inorganic fireproof board and preparation method for same
  • Composite inorganic fireproof board and preparation method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0027] Example: Composite inorganic fireproof board, such as figure 1 As shown, it includes a heat-insulating core layer 14, and strength structure layers 13 respectively compounded on both surfaces of the heat-insulating core layer. The heat insulation core layer is a layered structure made of inorganic adhesive as gelling agent, thermal insulation material as filler, and colloidal configuration; into a layered structure.

[0028] Preferably: the strength structure layer is added with performance supplementary materials, which are used to increase the bending strength and / or reduce the weight. Of course, for performance supplementary materials, it is effective to add, not add, or add less. Preferred options for performance supplementary materials: fiber materials and / or lightweight materials. Among them, lightweight fillers include: wood powder (bamboo powder), expanded vermiculite, expanded perlite, floating beads, diatomaceous earth, etc. Fiber materials include: orga...

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PUM

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Abstract

The invention relates to a composite inorganic fireproof board and a preparation method for the same. The composite inorganic fireproof board comprises a heat-insulation core layer and strength structural layers composited on two surfaces of the heat-insulation core layer respectively, wherein the heat-insulation core layer utilizes inorganic adhesives as gelatinizing agents and heat-insulation materials as fillers and is of a layered structure formed by means of gelatineous allocation and pressing, and each strength structural layer utilizes inorganic adhesives as gelatinizing agents and is of a layered structure formed by means of mixed gelatineous allocation and pressing. The composite inorganic fireproof board has outstanding substantive characteristics, and utilizes the inorganic adhesives as the gelatinizing agents to be mixed with the heat-insulation materials, and / or light materials and reinforcing fibers so that a board of a multi-layer composite layer is formed, the core layer has the advantages of light weight and fine heat-insulation and fireproof effects, and the strength structural layers on two surfaces of the heat-insulation core layer has the advantages of bending resistance and high compression strength. Besides, the composite inorganic fireproof board is simple in preparation process, suitable for batch production and integrates high efficiency and high quality.

Description

technical field [0001] The invention relates to a composite inorganic fireproof board and a preparation method thereof. Background technique [0002] There are many fireproof panels produced by inorganic materials, such as: [0003] Gypsum board: There are paper reinforced gypsum board, gypsum ceiling, gypsum wallboard. [0004] Cement board: There are TK board, FC board, Eternit board, calcium silicate board, calcium silicate board, glass magnesium board, etc. [0005] In the current production of inorganic material boards, the gelling materials of the surface layer and the middle layer of the board are the same, the material ratio is the same, the density is the same, the strength is the same, and the thermal conductivity is the same. There are only two ways to increase the strength of the plate, one is to increase the thickness, and the other is to increase the density. Increasing the thickness and density will increase the weight of the board, and then increase the pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/94E04B1/80B32B5/24
CPCE04B1/942E04C2/284E04B1/94B32B5/24E04C2/26E04B1/80B32B5/14
Inventor 支亮
Owner NG TERASUN AIR DUCT
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