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Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method

A wire electrical discharge machining and semiconductor technology, applied in the field of online electrical discharge machining devices, can solve the problems of difficult machining fluid supply, cutting wire deflection, and reduction of processing chip discharge ability, and achieve the effect of suppressing the reduction of machining accuracy and restraining deflection

Active Publication Date: 2014-04-30
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, according to the technology disclosed in Patent Document 2, as the machining process progresses and the machining groove becomes deeper, it is difficult to supply the machining fluid to the tip of the slit, and there is a problem that the ability to discharge machining chips decreases.
In addition, if the discharge pressure of the machining fluid is increased to supply the machining fluid to the top end of the machining tank, the pressure of the machining fluid will locally act on the cutting line, so there is a problem that the cutting line bends and the machining accuracy decreases.
In addition, there is a problem that the wire electrode is easily short-circuited due to the deflection of the cutting wire and is pressed against the processed surface of the cutting wire.
In addition, the technique disclosed in Patent Document 3 is a technique for supplying a machining fluid containing abrasive grains to a machining tank, and is not a technique for solving the problem of discharging machining chips.

Method used

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  • Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method
  • Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method
  • Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method

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Embodiment approach 1

[0030] Hereinafter, the structure and operation of the embodiment of the present invention will be described. figure 1 It is a perspective view showing the wire electrical discharge machining device according to the first embodiment. In the wire electric discharge machining device according to Embodiment 1, one wire electrode 2 drawn out from the bobbin 1 is wound multiple times among the plurality of guide rollers 3a to 3d sequentially with a slight interval therebetween, thereby forming multiple A cutting line portion 2a. That is, the wire electrode 2 has a plurality of cutting line portions 2a. The distance between the cutting line portions 2 a formed by winding the wire electrode 2 becomes the processing width (thickness) of the workpiece 8 . That is, in a state in which the workpiece 8 is arranged opposite to each cutting line portion 2a at a predetermined distance, a voltage is applied between each cutting line portion 2a and the workpiece 8, and at the same time, the ...

Embodiment approach 2

[0051] Figure 7 It is a partial enlarged perspective view of the nozzle 180 included in the wire electrical discharge machining device according to the second embodiment. Figure 8 yes Figure 7 A side cross-sectional view of nozzle 180 is shown. The same reference numerals are assigned to the same configurations as those in Embodiment 1, and detailed description thereof will be omitted. In the second embodiment, the structure of the nozzle is changed in order to facilitate the penetrating operation of the wire electrode 2 (plurality of cutting line portions 2a).

[0052] In Embodiment 2, the main body 184 has a structure that sandwiches the through hole 96 (the ejection port 82 , the wire passage hole 94 , and the discharge port 83 ) so that it can move in a direction approximately perpendicular to the direction in which the wire electrodes 2 pass through and the parallel direction. segmentation. More specifically, as Figure 7 , Figure 8 As shown, the main body 184 i...

Embodiment approach 3

[0057] Figure 9 It is a partial enlarged perspective view of the nozzle 180 included in the wire electrical discharge machining device according to the third embodiment. Figure 10 yes Figure 9 A side cross-sectional view of nozzle 180 is shown. In addition, the same code|symbol is attached|subjected to the same structure as the said embodiment, and detailed description is abbreviate|omitted.

[0058]In the first embodiment described above, there is one pipe connection hole 81 , and the machining fluid flows into the main body 184 through the pipe connection hole 81 . The pipe connection hole 81 is processed at the center of the main body 184 , and the parallel cut line portion 2 a passes right above the pipe connection hole 81 . When the number of line-cutting parts 2a arranged in parallel increases or the spacing between parallel lines decreases, part of the line-cutting parts 2a may be bent by the pressure of the machining fluid sprayed from the pipe connection hole 81...

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Abstract

A wire electric discharge machining apparatus is constructed in such a manner as to include: a wire electrode having a plurality of cutting wire portions that are separated from one another in parallel and are opposed to a workpiece; a machining power supply that generates a pulsed machining voltage; a plurality of power feed contact units that are electrically connected to the cutting wire portions and apply the machining voltage between the cutting wire portions and the workpiece; and a nozzle that ejects machining liquid from an ejection opening toward an electrode gap along the cutting wire portions.

Description

technical field [0001] The present invention relates to a wire electric discharge machining device: by winding the electrode wires between a plurality of guide rollers, the electrode wires are arranged side by side, and by generating electric discharge between the parallel electrode wires and the workpiece, the workpiece can be cut at one time. A plurality of plate-shaped components are produced. Background technique [0002] In the case of processing a thin plate from a columnar workpiece by wire electric discharge machining, a plurality of cut line portions are formed by winding one electrode wire between a plurality of guide rollers, and each cut line portion is It is proposed in Patent Document 1, for example, to supply power separately to simultaneously generate discharge between each cutting line portion and the workpiece to improve the productivity of the above-mentioned slicing process of the workpiece. [0003] In the electrical discharge wire saw having the above ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H7/02
CPCB23H1/028B23H7/101B23H11/006B23H7/02B23H7/107B23H9/00
Inventor 三宅英孝佐藤达志福岛一彦
Owner MITSUBISHI ELECTRIC CORP