Wire electric discharge machining apparatus, wire electric discharge machining method, thin board manufacturing method and semiconductor wafer manufacturing method
A wire electrical discharge machining and semiconductor technology, applied in the field of online electrical discharge machining devices, can solve the problems of difficult machining fluid supply, cutting wire deflection, and reduction of processing chip discharge ability, and achieve the effect of suppressing the reduction of machining accuracy and restraining deflection
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Embodiment approach 1
[0030] Hereinafter, the structure and operation of the embodiment of the present invention will be described. figure 1 It is a perspective view showing the wire electrical discharge machining device according to the first embodiment. In the wire electric discharge machining device according to Embodiment 1, one wire electrode 2 drawn out from the bobbin 1 is wound multiple times among the plurality of guide rollers 3a to 3d sequentially with a slight interval therebetween, thereby forming multiple A cutting line portion 2a. That is, the wire electrode 2 has a plurality of cutting line portions 2a. The distance between the cutting line portions 2 a formed by winding the wire electrode 2 becomes the processing width (thickness) of the workpiece 8 . That is, in a state in which the workpiece 8 is arranged opposite to each cutting line portion 2a at a predetermined distance, a voltage is applied between each cutting line portion 2a and the workpiece 8, and at the same time, the ...
Embodiment approach 2
[0051] Figure 7 It is a partial enlarged perspective view of the nozzle 180 included in the wire electrical discharge machining device according to the second embodiment. Figure 8 yes Figure 7 A side cross-sectional view of nozzle 180 is shown. The same reference numerals are assigned to the same configurations as those in Embodiment 1, and detailed description thereof will be omitted. In the second embodiment, the structure of the nozzle is changed in order to facilitate the penetrating operation of the wire electrode 2 (plurality of cutting line portions 2a).
[0052] In Embodiment 2, the main body 184 has a structure that sandwiches the through hole 96 (the ejection port 82 , the wire passage hole 94 , and the discharge port 83 ) so that it can move in a direction approximately perpendicular to the direction in which the wire electrodes 2 pass through and the parallel direction. segmentation. More specifically, as Figure 7 , Figure 8 As shown, the main body 184 i...
Embodiment approach 3
[0057] Figure 9 It is a partial enlarged perspective view of the nozzle 180 included in the wire electrical discharge machining device according to the third embodiment. Figure 10 yes Figure 9 A side cross-sectional view of nozzle 180 is shown. In addition, the same code|symbol is attached|subjected to the same structure as the said embodiment, and detailed description is abbreviate|omitted.
[0058]In the first embodiment described above, there is one pipe connection hole 81 , and the machining fluid flows into the main body 184 through the pipe connection hole 81 . The pipe connection hole 81 is processed at the center of the main body 184 , and the parallel cut line portion 2 a passes right above the pipe connection hole 81 . When the number of line-cutting parts 2a arranged in parallel increases or the spacing between parallel lines decreases, part of the line-cutting parts 2a may be bent by the pressure of the machining fluid sprayed from the pipe connection hole 81...
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