Method for cooling a workpiece made of semiconductor material during wire sawing
A technology for semiconductors and workpieces, used in semiconductor/solid-state device manufacturing, work accessories, manufacturing tools, etc., which can solve problems such as reduced cutting quality, damaged cutting suspension viscosity, and sufficient dissipation.
Active Publication Date: 2014-12-17
SILTRONIC AG
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- Description
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- Application Information
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Problems solved by technology
In this way, the viscosity of the cutting suspension is likewise compromised, so the cutting quality also decreases
In addition, the degree to which the gas is suitable for cooling is very limited because of its relatively low heat capacity, which usually does not ensure that the heat generated during the cutting process can be adequately dissipated
Method used
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Embodiment Construction
[0021] An embodiment of the method according to the invention is by means of figure 2 Make the following instructions:
[0022] A conventional wire saw is used in the method according to the invention. The main components of these wire saws consist of a frame, a forward feed device and a cutting tool consisting of a web of parallel wire zones. The workpiece is usually fixed on a fixed plate and clamped with it in the wire saw.
[0023] Typically, the wire web of a wire saw is formed by a plurality of parallel wire sections 6 tensioned between at least two (and optionally three, four, or more) wire guide rollers 7 , the wire guide rollers are mounted rotatably, and at least one wire guide roller is driven. The wire section usually belongs to a single wire of finite length which is guided in a spiral around the roller system and unwound from the storage roller onto the take-up roller.
[0024] The cutting suspension is applied to the wire zone via nozzles 5 . A workpiece 3...
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Abstract
A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.
Description
technical field [0001] The invention relates to a method for cooling cylindrical workpieces made of semiconductor material, such as silicon, germanium or gallium arsenide, during wire cutting in which a liquid coolant is applied to the semiconductor through a nozzle. material workpiece. Background technique [0002] For electronics, microelectronics, and microelectromechanical applications, semiconductor wafers with extremely high global and local flatness requirements are used as starting materials (substrates), requiring local flatness (nanotopography), roughness, and degree and cleanliness. A semiconductor wafer is a wafer of semiconductor material, especially compound semiconductors such as gallium arsenide, and predominantly elemental semiconductors such as silicon and sometimes germanium. According to the prior art, semiconductor wafers are produced in a number of successive method steps: In a first step, for example, a single crystal (rod) of semiconductor material ...
Claims
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IPC IPC(8): B28D7/02
CPCB28D5/0076B28D1/08H01L21/30
Inventor P·维斯纳A·胡贝尔
Owner SILTRONIC AG