Etching solution composition
A technology of composition and etching solution, which is applied in the direction of surface etching composition, electrical components, printed circuit manufacturing, etc., and can solve the problems of non-economy and complicated etching process
Active Publication Date: 2014-10-01
DONGWOO FINE CHEM CO LTD
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Problems solved by technology
[0005] However, if different etchant compositions are used to etch the pixel electrodes, source / drain electrodes, and buffer films, the etching process becomes complicated and there is a disadvantage of being uneconomical.
Method used
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Effect test
Embodiment 1- Embodiment 5、 comparative example 1- comparative example 3
[0037] Example 1-Example 5, Comparative Example 1-Comparative Example 3: Preparation of Etching Solution Composition 180 kg of etching solution compositions were produced with the components and composition ratios described in Table 1 below.
[0038]
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The present invention relates to an etching solution composition for triple films formed with In, Al, and Mo, and said composition comprises, with respect to the total weight of the composition: phosphoric acid 45 to 70 weight%; nitric acid 2 to 10 weight%; acetic acid 5 to 25 weight%; perfluorinated compounds 0.01 to 3 weight%; phosphate 0.1 to 5 weight%; and residual water.
Description
technical field [0001] The invention relates to an etchant composition for a triple film, a manufacturing method for forming an array substrate for a flat panel display device using the etchant composition, and an array substrate for a flat panel display device manufactured by the method; The etchant composition for the triple film can uniformly etch indium-containing pixel electrodes, aluminum-containing source / drain electrodes, and molybdenum-containing buffer films containing In, Al, and Mo among the components of the flat panel display device. Background technique [0002] In a flat panel display device, the process of forming metal wiring on a substrate generally includes the following steps: forming a metal film by sputtering; coating, exposing, and developing a photoresist on the metal film to form a photoresist in a selective area. etchant; and etching the metal film. In addition, cleaning steps before and after individual unit steps are also included. This etching...
Claims
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IPC IPC(8): C09K13/08C23F1/20H05K1/02
CPCC09K13/08H05K3/067C23F1/16
Inventor 梁承宰李昔准权五柄
Owner DONGWOO FINE CHEM CO LTD
