Etchant composition, method for forming metal pattern, and method for manufacturing array substrate
A composition and etchant technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., and can solve problems such as damage to lower data lines
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[0054] Preparation of etchant composition
[0055] An etchant composition weighing 10 kg was prepared using the composition ratios given in Table 1 below.
[0056] [Table 1]
[0057] (wt%)
HNO 3
h 2 SO 4
SPS
NHP
PDCA
water
Example 1
10.0
7.0
15
2.0
0.5
65.5
Example 2
7.0
4.5
12.0
0.5
0.1
76.4
Example 3
13.0
10.0
17.0
4.0
0.8
55.2
Comparative example 1
6.0
3.0
11.0
0.4
-
79.6
Comparative example 2
14.0
11.0
18.0
5.0
0.9
51.1
Comparative example 3
10.0
7.0
15
2.0
0.9
65.1
[0058] SPS: sodium persulfate
[0059] NHP: sodium hydrogen phosphate
[0060] PDCA: pyridine-2,6-dicarboxylic acid
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