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Device for taking out glass substrates

A technology for taking out devices and glass substrates, applied in transportation and packaging, conveyor objects, optics, etc., can solve problems such as low efficiency, easy damage to glass substrates, and many people, achieving high efficiency, short time consumption, and high degree of automation Effect

Inactive Publication Date: 2012-08-01
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned whole shard processing process requires a lot of personnel, takes a long time and is inefficient, and because the distance between the glass substrates carried in the cassette is small, it is easy to damage other parts around the glass substrate shards during the process of thinning the glass with scissors. Glass substrate, causing secondary damage

Method used

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  • Device for taking out glass substrates
  • Device for taking out glass substrates
  • Device for taking out glass substrates

Examples

Experimental program
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Embodiment Construction

[0016] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0017] Please refer to Figure 1 to Figure 3 The glass substrate removal device 100 of the embodiment of the present invention is used to remove the glass substrate 70 or glass substrate fragments (not shown) in the glass substrate cassette 60, including a frame 10, a conveying device 20, a first driving element 30, The receiving element 40, the automatic clamping mechanism 50, the second driving element (not shown) and the third driving element (not shown).

[0018] The frame 10 is located at the bottom of the taking out device 100 and is used to support other components of the taking out device 100 . In this embodiment, the rack 10 is in the shape of a disk. In order to facilitate handling, universal casters (not shown) can also be installed on the bottom of the frame 10 . In practical applications, the frame 10 can also be replaced by other mech...

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PUM

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Abstract

The invention discloses a device for taking out glass substrates, which is used for taking out glass substrates or glass substrate fragments in a glass substrate cassette. The device for taking out glass substrates comprises a frame, a conveying device and a first drive element, wherein the conveying device comprises a bracket and a plurality of transmission rods which lie on the same plane and are vertically arranged on the bracket at intervals along the length direction of the bracket; the first drive element is fixed on the frame and connected with the conveying device; the bracket is driven by the first drive element to horizontally move along a first horizontal direction so as to ensure that the transmission rod enters or moves out of the glass substrate cassette along the first horizontal direction; and the transmission rod is further driven by the first drive element to rotate around own axial line. Through the mode, the device for taking out glass substrates can be extended into the glass substrate cassette to take out glass substrates or large glass substrate fragments at a time, so that the device has the advantages of high automation degree, short time consumption and high efficiency, and the taken out glass substrates or glass substrates around the taken out glass substrates cannot be subjected to secondary damage.

Description

technical field [0001] The invention relates to the field of liquid crystal displays, in particular to a device for taking out a glass substrate. Background technique [0002] In the manufacturing process of liquid crystal displays, it is necessary to move the glass substrate from the cassette to the process line and complete the required manufacturing process. The thickness of the glass substrate is usually only 0.4-0.7mm, and it is usually relatively brittle. Therefore, it is necessary to detect whether the glass substrate is damaged during the process of loading or unloading the glass substrate. [0003] At present, in the process of loading or unloading glass, when glass substrate fragments are detected, first, the cassette carrying the glass substrate is moved to a manual truck, and then, the debris removal plan is determined according to the location of the fragments and the degree of damage. Generally speaking, it is necessary to place the small recycling bin on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G49/06B65G47/74
CPCG02F1/1333B65G49/067G02F1/1303
Inventor 李贤德吴俊豪林昆贤汪永强朱二庆杨卫兵
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD