Picking and placing device of glass substrate

Abstract

The invention discloses a picking and placing device of a glass substrate. The picking and placing device comprises a stand, a conveying platform, a vertical translation mechanism and a horizontal translation mechanism, wherein the conveying platform comprises a driving part which is arranged on the stand; the driving part comprises a first framework and a plurality of first driving rods which are arranged in the first direction in parallel and are supported against the first framework; the vertical translation mechanism is used for driving the conveying platform to move in the vertical direction, so that the conveying platform is lifted to a specified height; the horizontal translation mechanism is used for driving the conveying platform to move in the first horizontal direction, so that the driving part gets in and out of a cassette; and the first driving rods rotate around the axes of the first driving rods, so that the glass substrate supported against the first driving rods moves in and out of the cassette. In such a mode, the picking and placing device can be utilized to extend into the cassette to haul out the glass substrate or a damaged glass substrate and newly place the glass substrate subjected to sampling inspection back into the cassette, so that the picking and placing device has the advantages of high degree of automation, short time consumption, high efficiency and capability of preventing the picked glass substrate from being damaged.

Description

technical field [0001] The invention relates to the field of liquid crystal displays, in particular to a pick-and-place device for a glass substrate. Background technique [0002] In the manufacturing process of liquid crystal displays, it is necessary to transfer the glass substrate from the cassette to the process line and complete the required manufacturing process. Furthermore, during the conveying process, the glass substrate carried in the cassette needs to be taken out of the cassette for random inspection, and after the glass substrate is taken out of the cassette and passes the random inspection, it needs to be put back into the cassette. The thickness of the glass substrate is usually only 0.4-0.7mm, and it is usually relatively brittle, so the glass substrate is easily damaged during the process of loading or unloading the glass substrate. In addition, when the glass substrate is damaged, it is necessary to take out the damaged glass substrate in the cassette. ...

AI Technical Summary

Problems solved by technology

[0003] Because the distance between the glass substrates in the cassette is very small, there is currently no pick-and-place device for taking out or putting back the glass substrates or damaged glass substrates. The actions of picking and placing the glass substrates or damaged glass substrates are all done manually. It takes a long time and the probability of fragmentation is high, so it is difficult to put it back into the cassette

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