Method for detecting height of wafer splitting breakpoint
A wafer, high-level technology, applied in special data processing applications, measuring devices, instruments, etc., can solve time-consuming and labor-intensive problems, achieve the effect of ensuring smoothness and quality, and improving production capacity
Inactive Publication Date: 2014-08-20
HORNG TERNG AUTOMATION
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a method for detecting the height of the wafer splitting breakpoint, which improves the current method of splitting the wafer of the same type. Disadvantages of time-consuming and labor-intensive operations to establish
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[0018] The technical means adopted by the present invention to achieve the intended invention purpose are further described below in conjunction with the drawings and preferred embodiments of the present invention.
[0019] The wafer splitting breakpoint height detection method of the present invention mainly includes: a wafer automatic splitting detection step and a contrast adjustment step, wherein:
[0020] The wafer automatic splitting detection step is performed by a computer-controlled wafer splitter, and the computer is selected from a manual measurement step for a wafer to be inspected in its built-in processing steps. A predetermined sampling section in a plurality of predetermined sampling sections set by the circle is used as a splitting detection section, and a plurality of sequentially arranged splitting positions are planned in the selected splitting detection section, And set the number of times of sampling at the splitting position (n), and also set the predete...
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The invention relates to a method for detecting height of a wafer splitting breakpoint. The method comprises a wafer automatic splitting detection program and a comparison adjustment program, wherein the wafer automatic splitting detection program comprises the steps of utilizing a wafer splitter controlled by a computer to detect whether a sampling area segment selected by a wafer performs the splitting movement of the wafer according to settings, after the wafer is split, recording the height of a breakpoint at the splitting position, and then counting the heights of the breakpoints at multiple splitting positions of each area segment of the wafer, and obtaining the average value; the comparison adjustment program comprises the steps of comparing the obtained statistic average value of the split wafer with the artificially measured average value in the same sampling area segment, according to the difference value, adjusting the height to the best splitting height of the actual wafer splitting height, thereby obtaining the curvature change of the wafer surface of the same batch and same type wafers, namely, the curvature change can be used as the reference basis for subsequent wafer splitting, and the quality and capacity of the subsequent wafer splitting operation can be ensured.
Description
technical field [0001] The invention relates to a method for detecting the height of a wafer splitting breakpoint, especially a wafer splitting breakpoint that can quickly establish the surface curvature of the same type of wafer to be split to facilitate wafer splitting operations height detection method. Background technique [0002] At present, after the semiconductor front-end processing of the wafer is completed, when the back-end assembly is to be performed, the wafer must be split into several dies, and then the dies are adhered to the carrier for packaging and other steps. [0003] However, at present, the splitting operation of the wafer can only use the thickness of the wafer as a reference value. When the semiconductor processing of the wafer is completed, and the laser is used to cut the grooves between the grain units, the splitting depth will change due to the change of the laser cutting depth. The height of the breakpoint is a variable value. Therefore, durin...
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IPC IPC(8): H01L21/66G01B11/02G06F17/50
Inventor 张宏铭张振昌
Owner HORNG TERNG AUTOMATION