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Electronic device body, assembly components and identification method thereof, and electronic device

A technology for assembling components and electronic equipment, applied in the field of electronics, can solve the problems of unfavorable manufacturers' production diversity, failure to identify components of different specifications and models, and failure to identify manufacturers, etc., to avoid risks, expand the scope of procurement, and reduce costs. Effect

Active Publication Date: 2012-09-12
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing identification methods can only identify two manufacturers, cannot identify more manufacturers, let alone identify components of different specifications and models produced by the same manufacturer, which is not conducive to the diversity of manufacturers' production

Method used

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  • Electronic device body, assembly components and identification method thereof, and electronic device
  • Electronic device body, assembly components and identification method thereof, and electronic device
  • Electronic device body, assembly components and identification method thereof, and electronic device

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] The method for identifying an assembled component of an electronic device body provided by an embodiment of the present invention, such as figure 1 As shown, the method steps include:

[0027] S101. After the assembly component is connected to the electronic device body, the electronic device body reads at least two preset level value combinations of General Purpose Input Output (GPIO for short) of the assembly component through the bus.

[0028] Exemp...

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PUM

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Abstract

The embodiment of the invention provides a method for an electronic device body to identify assembling components, the electronic device body, the assembling components, and an electronic device, and relates to the electronic field, wherein the electronic device body is capable of identifying information of more than two parameters of the assembling components. The identification method comprises the steps of: reading a level value combination preset by at least two GPIOs of the assembling components through a bus after the assembling components access the electronic device body; matching the read level value combination with a level value combination pre-stored by the electronic device itself; and determining parameter information of the assembling components according to the successfully matched level value combination after successful matching. The embodiment of the invention is used for electronic device manufacturing.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a method for an electronic equipment body to identify an assembled component, an electronic equipment body, an assembled component and an electronic equipment. Background technique [0002] In recent years, with the development of communication electronic devices, many electronic devices have begun to use cameras to improve the functionality of the devices themselves. At present, most electronic equipment manufacturers generally purchase cameras produced by other camera manufacturers, and then assemble them on the electronic equipment bodies produced by themselves. In this way, how the electronic device body can effectively distinguish between different manufacturers, or camera components of different models and specifications produced by the same manufacturer has become an important issue. [0003] At present, the identification of the camera component by the electronic device body i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F13/10
Inventor 王硕强
Owner HONOR DEVICE CO LTD
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