Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An electronic device body, an assembly component and its identification method, and the electronic device

A technology for assembling components and electronic equipment, applied in the field of electronics, can solve the problems of unable to identify manufacturers, unable to identify components of different specifications and models, unfavorable manufacturers' production diversity, etc., to avoid risks, expand procurement scope, and reduce costs. Effect

Active Publication Date: 2016-09-14
HONOR DEVICE CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing identification methods can only identify two manufacturers, cannot identify more manufacturers, let alone identify components of different specifications and models produced by the same manufacturer, which is not conducive to the diversity of manufacturers' production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An electronic device body, an assembly component and its identification method, and the electronic device
  • An electronic device body, an assembly component and its identification method, and the electronic device
  • An electronic device body, an assembly component and its identification method, and the electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] The method for identifying an assembled component of an electronic device body provided by an embodiment of the present invention, such as figure 1 As shown, the method steps include:

[0027] S101. After the assembly component is connected to the electronic device body, the electronic device body reads at least two preset level value combinations of General Purpose Input Output (GPIO for short) of the assembly component through the bus.

[0028] Exemp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Embodiments of the present invention provide a method for identifying an assembly component by an electronic device body, an electronic device body, an assembly component, and an electronic device, and relate to the field of electronics. The electronic device body can identify two or more parameter information of the assembly component. The identification method includes: after the assembly component is connected to the electronic device body, reading at least two GPIO preset level value combinations of the assembly component through the bus; combining the read level value combination with its own pre-stored The level value combination is matched; after the matching is successful, the parameter information of the assembly component is determined according to the successfully matched level value combination. The embodiments of the present invention are used in the manufacture of electronic equipment.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a method for an electronic equipment body to identify an assembled component, an electronic equipment body, an assembled component and an electronic equipment. Background technique [0002] In recent years, with the development of communication electronic devices, many electronic devices have begun to use cameras to improve the functionality of the devices themselves. At present, most electronic equipment manufacturers generally purchase cameras produced by other camera manufacturers, and then assemble them on the electronic equipment bodies produced by themselves. In this way, how the electronic device body can effectively distinguish between different manufacturers, or camera components of different models and specifications produced by the same manufacturer has become an important issue. [0003] At present, the identification of the camera component by the electronic device body i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/10
Inventor 王硕强
Owner HONOR DEVICE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com