Digital DLL for timing control in semiconductor memory
A memory and semiconductor technology, used in static memory, automatic power control, digital memory information, etc.
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[0053] A 2.25Mb embedded dynamic random access memory ("eDRAM") macro was designed, fabricated and tested. The eDRAM macro has a structure including 32 standard memory banks, each of which is structured with 1184 columns (including redundant columns) and 64 rows. A 33rd bank (redundant bank) is included for 16 independent row corrections.
[0054] Each memory cell includes an n-type memory transistor and a metal-insulator-metal ("MIM") capacitor. The 288b data port has separate input and output data buses. A test chip was fabricated using 192 instances of a 2.25Mb macro, where every 8 eDRAM macros were assigned a built-in self-test ("BIST") module.
[0055] Each delay line includes 20 delay elements that generate 20 different clock phases such that the phase-to-phase delay is five percent (5%) of the clock period. For the operating conditions of TT, 1V and 115°C, one encoding step changes the delay of each phase by approximately 2ps. Timing accuracy is maintained to approx...
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