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Digital DLL for timing control in semiconductor memory

A memory and semiconductor technology, used in static memory, automatic power control, digital memory information, etc.

Inactive Publication Date: 2015-03-11
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as on-chip memory density increases, the increased leakage energy per transistor makes SRAM less attractive

Method used

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  • Digital DLL for timing control in semiconductor memory
  • Digital DLL for timing control in semiconductor memory
  • Digital DLL for timing control in semiconductor memory

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[0053] A 2.25Mb embedded dynamic random access memory ("eDRAM") macro was designed, fabricated and tested. The eDRAM macro has a structure including 32 standard memory banks, each of which is structured with 1184 columns (including redundant columns) and 64 rows. A 33rd bank (redundant bank) is included for 16 independent row corrections.

[0054] Each memory cell includes an n-type memory transistor and a metal-insulator-metal ("MIM") capacitor. The 288b data port has separate input and output data buses. A test chip was fabricated using 192 instances of a 2.25Mb macro, where every 8 eDRAM macros were assigned a built-in self-test ("BIST") module.

[0055] Each delay line includes 20 delay elements that generate 20 different clock phases such that the phase-to-phase delay is five percent (5%) of the clock period. For the operating conditions of TT, 1V and 115°C, one encoding step changes the delay of each phase by approximately 2ps. Timing accuracy is maintained to approx...

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Abstract

A semiconductor memory includes a delay locked loop (DLL) configured to generate a timing code based on a clock signal. A plurality of memory devices are coupled to the DLL. Each of the plurality of memory devices is configured to generate internal control signals for operating a memory array based on the timing code received from the DLL.

Description

technical field [0001] The disclosed systems and methods relate to semiconductor memory. More specifically, the disclosed systems and methods relate to timing control of multiple embedded dynamic random access memory (eDRAM) modules. Background technique [0002] The reduction in technology scale allows a large number of system components to be located on a single chip. From below 65nm, computing chips and networking chips include multiple cores, which require each chip to have a large amount of memory. Given the need for high-speed random access, static random access memory ("SRAM") is often the first choice. However, as on-chip memory density increases, the increased leakage energy per transistor makes SRAM less attractive. At the same time, process fluctuations also affect the stability of the SRAM cell and reduce the static noise margin (especially at low voltages). In high-power-sensitive designs with embedded memory, system designers turn to embedded DRAM, which co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C11/4076
CPCH03L7/0816G11C7/222H03L7/0814H03K5/133G11C7/04G11C8/00G11C11/407G11C11/4076
Inventor 谢尔吉·罗曼诺夫斯基
Owner TAIWAN SEMICON MFG CO LTD