Defoaming device for photoresist

Abstract

An embodiment of the invention discloses a defoaming device for photoresist. The device includes: a pipeline fixing seat is provided with pipeline through holes passing through the top and the bottom of the pipeline; and a photoresist bearing groove is connected with the pipeline fixing seat. According to the photoresist defoaming device provided by the embodiment of the invention, as the photoresist bearing groove is filled with photoresist, the photoresist surface is higher than a photoresist line port to form certain pressure on the photoresist in the pipeline during replacement of photoresist bottle, so as to overcome gravity of the photoresist in the pipeline. Therefore, photoresist within the pipeline will not drop off due to its gravity, thereby avoiding air flowing into the pipe; and air bubble generation during replacement of photoresist bottle is fundamentally avoided, so that photoresist does not need to be wasted for air bubble elimination, and photoresist is greatly saved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a photoresist defoaming device. Background technique [0002] In the manufacturing process of semiconductor devices, the application of photolithography process is very frequent, and the amount of photoresist is also very large. In the photoresist transmission system of the photoresist coating machine, the input pipeline of photoresist (ie, photoresist) is directly inserted into the bottle (ie, photoresist bottle) containing photoresist. When using a photoresist bottle, it is necessary to take out the pipeline at the photoresist input end from the current photoresist bottle, and then put it into another photoresist bottle, which will cause the pipeline at the photoresist input end to be directly connected for a while. Exposure to the air, at this time, the photoresist in the pipeline will drop a small amount, so that the air enters the pipeline, when i...

AI Technical Summary

Problems solved by technology

In the photoresist transmission system of the photoresist coating machine, the input pipeline of photoresist (ie, photoresist) is directly inserted into the bottle (ie, photoresist bottle) containing photoresist. When using a photoresist bottle, it is necessary to take out the pipeline at the photoresist input end from the current photoresist bottle, and then put it into another photoresist bottle, which will cause the pipeline at the photoresist input end to be directly connected for a while. Exposure to the air, at this time, the photoresist in the pipeline will drop a small amount, so that the air enters the pipeline, when inserting the photoresist input end pipeline that enters the air into a new photoresist bottle After that, air bubbles will be formed in the pipeline. Before applying glue, the air bubbles need to be excluded from the photoresist transmission system, otherwise the quality of the product will be affected. Caused a great waste of photoresist cost

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