Covering member for micro electro mechanical device and manufacturing method thereof

Abstract

The invention discloses a covering member for a micro electro mechanical device and a manufacturing method thereof. The covering member for the micro electro mechanical device comprises a core plate, a sealing plate, a through hole and an electroplating metal layer, wherein the core plate comprises a first surface and a second surface, and an opening which penetrates through the first adhesive layer and the first and second surface; a first adhesive layer is arranged on the first surface; a second adhesive layer is arranged on the second surface; the sealing plate is combined to the first adhesive layer so as to seal one end of the opening; a part of surface of the sealing plate is exposed in the opening; the through hole penetrates through the sealing plate, the first and second adhesive layer and the core plate; and the electroplating metal layer is arranged on the exposed surface of the second adhesive layer, the wall of the through hole and the exposed surface of the sealing plate. By means of electric communication of various electroplating metal layers, the micro electro mechanical device and the covering member have high electromagnetic matching property, so that a shielding effect is achieved.

Description

technical field [0001] The present invention relates to a packaging structure and a manufacturing method thereof, in particular to a covering member of a micro-electromechanical device and a manufacturing method thereof. Background technique [0002] At present, microelectromechanical devices such as microphones are widely used in mobile communication equipment, audio devices, etc., and in order to prevent the microelectromechanical device from affecting the functions of other components, the microelectromechanical device must be covered with a covering member. In order to solve the above shortcomings, the industry is accustomed to using metal materials as the inner layer of the covering member to achieve the shielding effect; please refer to figure 1 , which is an existing cover member 1 used to cover micro-electromechanical devices, a core board 10 with an opening 100 is combined with an adhesive layer 12 on a board body 11, and then exposed on the hole wall of the opening...

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Problems solved by technology

[0003] However, since the inner wall of the covering member 1 is made of metal, it often causes problems of conductive electromagnetic interference (Electromagnetic interference; EMI) or radio frequency interference (Radio Frequency Interference; RFI); When the shielding layer of interference does not provide other electrical functions, it will limit the development of MEMS devices towards light, thin, short and small types

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