Electroless plating equipment and method

Abstract

Electroless plating equipment and a method are suitable for electroless plating treatment of at least a wafer. The above equipment comprises a tank unit, a wafer bearing unit, an electroless plating solution supply unit and an ultrasonic vibration unit, wherein the above tank unit is provided with at least a water inlet used for containing an electroless plating solution; the above wafer bearing unit is combined inside the above tank unit; the above electroless plating solution supply unit is used for supplying the electroless plating solution into the tank unit through the above water inlet; and the above ultrasonic vibration unit is combined inside the electroless plating tank unit and is used for causing uniform disturbances of the electroless plating solution in the tank unit. Therefore, uniformity of a plated film and micropore electroplating can be simultaneously improved.

Description

technical field [0001] The invention relates to an electroless plating equipment and method, in particular to a method suitable for wafers, which can make the concentration of the electroless plating solution evenly distributed, and can evenly flow through each wafer, so as to improve the uniformity of the coating thickness, and The invention discloses an electroless plating equipment and method for enhancing microporous electroplating by using ultrasonic vibration. Background technique [0002] Electroless plating is a mature plating technology, which is currently mainly used on non-wafer objects; therefore, there are no strict requirements on the uniformity of coating thickness, and there are very few requirements for microporous plating. [0003] In recent years, with the rapid development of semiconductor technology, the opportunity to apply electroless plating technology to wafers has also increased significantly; for example, the plating technology of backside via hole...

AI Technical Summary

Problems solved by technology

[0004] However, the aforementioned technologies have higher and higher requirements for the uniformity of coating thickness and microporous plating; in other words, in terms of performing wafer plating, the existing electroless plating technology will be difficult to meet the current needs

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