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Cooling device with bypass channel

A device and channel technology, applied in the field of cooling devices, can solve problems such as leakage of conductive cooling fluid

Inactive Publication Date: 2012-11-14
TM4 INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The downside of using fluids to collect and transfer heat is the risk of leaks that could bring conductive cooling fluid into contact with electronic components

Method used

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  • Cooling device with bypass channel
  • Cooling device with bypass channel
  • Cooling device with bypass channel

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Embodiment Construction

[0015] The indefinite article (a, an), when used in conjunction with the term "comprising" in the claims and / or specification, may mean "a", but is also used in conjunction with "one or more", "at least one" and "a or more than one" means the same. Similarly, the word "another" may mean at least a second or more.

[0016] As used in this specification and claims, the words "comprising" (and any form of including, such as plural and singular), "having" (and any form of having, such as plural and singular ), "including" (and any form of inclusion, such as the plural and singular), or "containing (and any form of containment, such as the plural and singular) is inclusive or open-ended, And further, unreferenced elements or method steps are not excluded.

[0017] In this description, and in the claims, various terms are used that are directional, geometric and / or spatial in nature, such as "longitudinal", "horizontal", "frontal", "rearward", "upwardly", "downwardly", etc. It s...

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PUM

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Abstract

A cooling device to which an electric circuit may be mounted includes a cooling body and a cover both defining a fluid cooling path. Inner and outer seals are provided between the body and the cover and a leak bypass channels leaking fluid away from the electric circuit is provided between the inner and outer seals.

Description

technical field [0001] The present disclosure relates to cooling devices. More specifically, the present disclosure relates to a cooling device to which a circuit is mounted and a bypass channel is provided. Background technique [0002] Cooling devices are well known in the field of electrical circuits. They are generally designed to collect heat generated by one or more electronic components and dissipate the collected heat away from the electronic components, thereby improving the performance of the electronic components, or in some cases, enabling the electronic components to function properly. [0003] Fluids are often used to collect heat and transfer it from the vicinity of electronic components to the vicinity of heat sinking elements. A drawback of using a fluid to collect and transfer heat is the risk of leaks that could bring the conductive cooling fluid into contact with the electronic components. Contents of the invention [0004] The invention discloses a ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCF28F2230/00H05K7/20509F28F3/12F28F3/10H05K7/20254H05K7/20H05K7/20263
Inventor M·霍尔S·波林
Owner TM4 INC