A soil surface roughness measuring board
A soil surface and roughness technology, applied in the field of remote sensing soil parameter measurement, can solve the problems of difficult measurement accuracy and speed, time-consuming and labor-intensive problems
Inactive Publication Date: 2015-12-09
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
[0004] At present, most soil surface roughness tests are based on the contact measurement method of the rod ruler method. Although the cost of the measuring device used is low, it needs to be inserted into the soil during the measurement, which is destructive to the soil surface. Therefore, the measurement The process is time-consuming and labor-intensive, and the measurement accuracy and speed are difficult to meet the requirements
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[0038] Specific embodiments of the present invention will be described below in conjunction with the accompanying drawings, so that those skilled in the art can better understand the present invention. It should be noted that in the following description, when detailed descriptions of known functions and designs may dilute the main content of the present invention, these descriptions will be omitted here.
[0039] figure 1 It is a structural diagram of a specific embodiment of the soil surface roughness measuring board of the present invention.
[0040] In this example, if Figure 4 As shown, the soil surface roughness measuring board of the present invention comprises: a vertically placed bottom plate 1, several probes 2;
[0041] The base plate 1 is rectangular, its color is black, its length is 1m, and its height is 0.525m; four corners of the base plate 1 are respectively provided with an obvious cross mark 5, 6, 7, 8, cross mark 5, 6, 7 and 8 are used as coordinate ref...
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The invention discloses a measuring plate of soil surface roughness. A plurality of probes are vertically and evenly arranged on the front of a vertically-arranged base plate, a round cap is sleeved at the bottom end of each probe, the bottom end of each probe is contacted with the soil surface and can vertically move along soil surface undulation, and color contrast ratio of the upper sections of the probes and the base plate is obvious. An actual height value of each probe is obtained, and the root-mean-square height and the relevant length of the surface feature soil surface roughness are calculated by photographing the measuring plate of the soil surface roughness and processing photographed pictures. The measuring plate of the soil surface roughness is simple in structure, not big in size, convenient to carry and applicable to field soil roughness measurement. In addition, altitude difference of soil surface undulation is obtained by photographing, so that the measuring plate is convenient to collect, short in time consumption and high in measurement efficiency. Finally, the round cap is arranged at the bottom end of each probe so that the probes cannot be inserted inside soil, and damage to the soil surface is avoided.
Description
technical field [0001] The invention belongs to the technical field of remote sensing soil parameter measurement, and more specifically relates to a soil roughness measurement board. Background technique [0002] Soil surface roughness is an important parameter that characterizes soil hydrological characteristics and affects soil properties. In microwave remote sensing, soil surface roughness is an important factor affecting soil microwave scattering characteristics, an important parameter in soil microwave scattering models, and the main parameter of soil parameter inversion. Therefore, it is necessary to accurately evaluate and measure soil surface roughness. The soil surface roughness is represented by the root mean square height and the correlation length. These two parameters respectively characterize the undulation of the soil surface in the vertical direction and the horizontal direction, that is, the roughness. [0003] There are usually two methods of measuring soi...
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IPC IPC(8): G01B11/30
Inventor 陈彦童玲贾明权庞少峰
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA