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Liquid cooling device

A technology of heat dissipation device and liquid cooling, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of not reducing the volume of liquid cooling device.

Inactive Publication Date: 2012-11-21
WISTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this background technology still retains a considerable volume of the cavity, and does not reduce the volume of the liquid-cooled heat sink

Method used

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  • Liquid cooling device
  • Liquid cooling device
  • Liquid cooling device

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Embodiment Construction

[0024] In order to make the above and other objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention are listed below and described in detail in conjunction with the accompanying drawings.

[0025] Please refer to figure 1 Regarding the liquid-cooled heat dissipation device according to an embodiment of the present invention, wherein figure 1 An exploded schematic diagram of a liquid-cooled heat sink.

[0026] like figure 1 As shown, the liquid-cooled heat sink 1 of the present invention is in contact with the external heating element 90 for dissipating the heat generated by the external heating element 90 . The liquid-cooled heat sink 1 includes a heat absorbing portion 10 , a first transmission pipe 20 , a second transmission pipe 30 and a heat dissipation portion 40 , and the connection between the heat absorption portion 10 , the heat dissipation portion 40 and the first transmission pipe 20 and the seco...

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Abstract

A liquid cooling device includes a heat absorbing part, a first transmitting tube, a second transmitting tube, and a heat dissipation part, wherein the heat absorbing part has a heat block, a first expansion pipe, and a second expansion pipe. The heat block is connected to an external heat-generating component, and includes a plurality of flow channels to facilitate the flow of a coolant for absorbing the heat generated from the external heat-generating component. The first expansion pipe and the second expansion pipe are connected to the heat block respectively. The first transmitting tube and the second transmitting tube are connected to the heat dissipation part respectively to form a cooling cycle among the heat absorbing part, the first transmitting tube, the second transmitting tube, and the heat dissipation part for allowing the cooling fluid to circulate in the cycle.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device. Background technique [0002] Due to the improvement of the operating efficiency of electronic devices, the operating efficiency of heating elements in electronic devices is also getting higher and higher. In order to maintain the normal operation of electronic devices, taking the cooling device of CPU in electronic devices as an example, liquid cooling is commonly used at present. System, and this kind of cooling device has a cavity on the heat-absorbing copper block that is in direct contact with the CPU for the flow of coolant, so that the coolant in the cavity can exchange heat with the heat-absorbing copper block, and then let the heat-absorbing copper block The contacted CPU cools down, but the cavity occupies a certain volume, which makes the liquid cooling system larger, and the contact area with the heat-absorbing copper block and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/473H01L2924/0002H01L2924/00
Inventor 陈建安江兴禹
Owner WISTRON CORP
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