Multi-channel water-cooled air-cooled mixing device structure for computer cpu

A mixing device, multi-channel technology, applied in circuits, electrical components, electro-solid devices, etc., can solve the problems of small application range and unsuitable application occasions, and achieve the effect of large application range, small water pressure loss, and short process flow.

Active Publication Date: 2016-06-29
蚌埠中知知识产权运营有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying.
However, in the existing water cooling mode, the cooling effect of the water cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its scope of application is small

Method used

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  • Multi-channel water-cooled air-cooled mixing device structure for computer cpu
  • Multi-channel water-cooled air-cooled mixing device structure for computer cpu

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Embodiment Construction

[0008] See figure 1 , figure 2 , which includes an upper cover plate 1, a micro-cutting cooling plate 2, the upper end surface of the upper cover plate 1 is provided with a water outlet 3, a water inlet 4, the upper cover plate 1 is mounted on the micro-cutting cooling plate 2, the upper cover plate 1, the micro-cutting cooling plate The cavity formed by cutting the cooling plate 2 is provided with a jet splitter plate 5, the jet splitter plate 5 has four parallel flow channel notches 6, and the water inlet 4 is connected to the four parallel flow channels along the upper surface of the jet splitter plate 5. The channel notch 6, the heat dissipation area of ​​the micro-cutting cooling plate 2 is arranged below the channel notch 6, and the heat dissipation area of ​​the micro-cutting cooling plate 2 is arranged with heat dissipation columns 7 in a rectangular array, and the bottom outer edge of the jet diverter plate 5 is arranged There are annular diversion groove 8 and wate...

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Abstract

The invention provides a multi-runner water-cooling and air-cooling mixed device structure for a computer CPU (central processing unit). The device structure enables temperature of a heating component to be lower than the environmental temperature, can be applied to various environmental occasions and is wide in application range, quiet and free of noise. The device structure comprises an upper cover plate and a microdissection cooling plate, and a water outlet and a water inlet are arranged on an upper end face of the upper cover plate which is covered on the microdissection cooling plate. The device structure is characterized in that an injection shunt plate is arranged in a cavity formed by the upper cover plate and the microdissection cooling plate and provided with at least four parallel runner notches, the water inlet is communicated to the runner notches along an upper surface of the injection shunt plate, and a heat radiating area of the microdissection cooling plate is arranged below the runner notches.

Description

technical field [0001] The invention relates to the technical field of computer CPU cooling, in particular to the structure of a multi-channel water-cooling and air-cooling mixing device for a computer CPU. Background technique [0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan, which brings loud noise and vibration, which is annoying. However, in the existing water-cooling cooling method, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its applicable range is small. Contents of the inven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H01L23/467G06F1/20
Inventor 谈士权
Owner 蚌埠中知知识产权运营有限公司
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