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Double-flow passage water-cooling and wind-cooling hybrid device structure for computer CPUs (central processing unit)

A technology of mixing device and dual flow channels, which is applied in electrical digital data processing, instruments, digital data processing parts, etc., can solve the problems of small application scope and unsuitable application occasions, and achieves large application scope, small water pressure loss, and guaranteed The effect of the cooling effect

Inactive Publication Date: 2013-01-02
WUXI FORMEN TECHN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying.
However, in the existing water cooling mode, the cooling effect of the water cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its scope of application is small

Method used

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  • Double-flow passage water-cooling and wind-cooling hybrid device structure for computer CPUs (central processing unit)
  • Double-flow passage water-cooling and wind-cooling hybrid device structure for computer CPUs (central processing unit)

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Embodiment Construction

[0008] See figure 1 , figure 2 , which includes an upper cover plate 1, a micro-cutting cooling plate 2, the upper end surface of the upper cover plate 1 is provided with a water outlet 3, a water inlet 4, the upper cover plate 1 is mounted on the micro-cutting cooling plate 2, the upper cover plate 1, the micro-cutting cooling plate The cavity formed by cutting the cooling plate 2 is provided with a jet splitter plate 5, the jet splitter plate 5 is provided with two parallel flow channel notches 6, and the water inlet 4 is connected to two parallel flow channel slots along the upper surface of the jet splitter plate 5. The runner notch 6 of the runner notch 6 is the heat dissipation area of ​​the micro-cut cooling plate 2, the heat dissipation area of ​​the micro-cut cooling plate 2 is arranged with heat dissipation columns 7 in a rectangular array, and the outer surface of the bottom of the jet splitter plate 5 The edge is provided with a diversion groove 8 and a water out...

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Abstract

The invention provides a double-flow passage water-cooling and wind-cooling hybrid device structure for computer CPUs, which can decrease the temperature of a heating device to be lower than the environmental temperature, can be applied to various environmental places, has a wide application range and is noiseless. The double-flow passage water-cooling and wind-cooling hybrid device structure comprises a top cover plate and a microcut cooling plate, the top end surface of the top cover plate is provided with a water outlet and a water inlet, and the microcut cooling plate is covered by the top cover plate. The double-flow passage water-cooling and wind-cooling hybrid device structure is characterized in that: a jet-splitting plate is arranged in the cavity defined by the top cover plate and the microcut cooling plate, the jet-splitting plate is provided with two parallel flow passage slots, the water inlet communicates with the two parallel flow passage slots along the top surface of the jet-splitting plate, and the heat-dispersing area of the microcut cooling plate is under the flow passage slots.

Description

technical field [0001] The invention relates to the technical field of computer CPU cooling, in particular to the structure of a dual-channel water-cooling and air-cooling mixing device for a computer CPU. Background technique [0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan, which brings loud noise and vibration, which is annoying. However, in the existing water-cooling cooling method, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its applicable range is small. Contents of the invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 谈士权
Owner WUXI FORMEN TECHN
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