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Method for automatically monitoring manufacturing procedure

An automatic monitoring and process technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as fragmentation, failure to set detectors, unfinished product transmission status, failure to meet requirements, etc., and achieve the effect of avoiding losses

Inactive Publication Date: 2015-04-01
MOTECH INDUSTRIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for etching equipment, due to the use of a large amount of corrosive chemical solutions in the chamber for the process, it is impossible to install a general detector in the chamber for monitoring the transmission status of the unfinished product
Once a large number of laminations occur inside the cavity, the machine will not issue an alarm, and can only rely on manual discovery. For example, during the rest time when the manpower is relatively tight, a large number of fragments are often found.
In addition, even detectors made of high-cost and high-resistance materials cannot meet the requirements

Method used

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  • Method for automatically monitoring manufacturing procedure
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Embodiment Construction

[0036] The invention is an automatic monitoring process method, which is suitable for various automatic equipments. In one embodiment, the method for automatically monitoring the process of the present invention is applied to etching equipment, and the present invention is not limited thereto, and can also be applied to, for example, cleaning equipment.

[0037] A method for automatically monitoring the process of the present invention includes: providing a plurality of substrates in sequence, making the above-mentioned substrates pass through the first position and the second position in sequence; detecting the above-mentioned substrates at the first position and the second position; Waiting for a predetermined delay time when each substrate at the position has not passed the second position after a predetermined time; and generating an alarm when each of the above-mentioned substrates passing the first position has not passed the second position after waiting for the predeter...

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Abstract

The invention provides a method for automatically monitoring a manufacturing procedure. The method comprises the following steps: sequentially providing multiple substrates and enabling the substrates to pass through a first position and a second position in turn; detecting the substrates at the first position and the second position; if the substrates passing through the first position do not pass through the second position within a predetermined time, waiting for a predetermined delay time; and after waiting for the predetermined delay time, if the substrates passing through the first position do not pass through the second position yet, generating an alarm. The method for automatically monitoring a manufacturing procedure provided by the invention can monitor the operation condition of the substrates, and can get the exception in carrying the substrates in time so as to avoid the loss of cost due to the overlapping of many substrates.

Description

technical field [0001] The invention relates to a method for automatically monitoring a process, and in particular to a method for automatically monitoring a process by using time. Background technique [0002] The automation equipment mainly includes the cavity for the process and the conveying device for conveying the unfinished products. The unfinished product is transported into the chamber for the process by the conveying device, and is conveyed out of the chamber after the processing is completed. [0003] During the processing process, the generation of fragments and laminations often directly affects the yield, thereby increasing the production cost. During the conveying process of the substrates, since the substrates are continuously conveyed one by one, the fragmented substrates are often collided by another following substrate, resulting in a large number of stacked substrates. In addition, the aging and rusting of the components of the conveying device will als...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/66
Inventor 赖建宇范姜正
Owner MOTECH INDUSTRIES