Method for automatically monitoring manufacturing procedure
An automatic monitoring and process technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as fragmentation, failure to set detectors, unfinished product transmission status, failure to meet requirements, etc., and achieve the effect of avoiding losses
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[0036] The invention is an automatic monitoring process method, which is suitable for various automatic equipments. In one embodiment, the method for automatically monitoring the process of the present invention is applied to etching equipment, and the present invention is not limited thereto, and can also be applied to, for example, cleaning equipment.
[0037] A method for automatically monitoring the process of the present invention includes: providing a plurality of substrates in sequence, making the above-mentioned substrates pass through the first position and the second position in sequence; detecting the above-mentioned substrates at the first position and the second position; Waiting for a predetermined delay time when each substrate at the position has not passed the second position after a predetermined time; and generating an alarm when each of the above-mentioned substrates passing the first position has not passed the second position after waiting for the predeter...
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