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Chip-type coil component

A coil component and chip technology, applied in the direction of electrical connection formation of electrical components, printed components, transformer/inductor coil/winding/connection, etc., can solve problems such as disconnection of channel conductor electrical connection

Inactive Publication Date: 2012-12-05
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Also, even if the via conductors deviate entirely from a straight line, the electrical connection between the via conductors may be broken

Method used

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  • Chip-type coil component
  • Chip-type coil component
  • Chip-type coil component

Examples

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Embodiment Construction

[0026] Now, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0027] However, the invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. The specific embodiments provided by the present invention enable those skilled in the art to understand the present invention more completely.

[0028] In the drawings, the shapes and dimensions of components may be exaggerated for clarity, and the same reference numerals will be used to designate the same or like components.

[0029] A chip coil component is an electronic component including a coil portion. There are laminated inductors that are only inductors in such chip coil components. The coil portion may be formed as part of the element, and other elements such as capacitors may be formed as another part of the element.

[0030] A laminated inductor will be taken as an example in the present ...

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PUM

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Abstract

There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers; external terminals formed on a surface of the body provided as a mounting surface among external surfaces of the body; a coil part including conductor patterns having a spiral structure in a lamination direction of the magnetic layers, the conductor patterns respectively formed on the magnetic layers; and lead-out parts formed in the lamination direction of the magnetic layers, and electrically connecting ends of the coil part and the external terminals, wherein the lead-out parts each include via conductors formed by penetrating the magnetic layers and via pads covering the via conductors while central lines of via conductors formed in adjacent magnetic layers are offset from each other.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2011-0052281 filed with the Korean Intellectual Property Office on May 31, 2011, the disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a chip coil component, and more particularly, to a chip coil component with good reliability. Background technique [0004] Recently, with the trend toward miniaturization, thinning, and weight reduction of electronic components, the demand for stacked electronic components has rapidly increased. [0005] The laminated inductor includes a body formed by laminating a plurality of magnetic layers, external terminals formed on the outer surface of the body, a coil portion formed in the body, and the like. [0006] When the multilayer inductor is mounted on a substrate, external terminals may be formed on the bottom surface in consideration of easy surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/04H01F37/00H01F27/28H01F27/29H01F41/00
CPCH01F17/0013H01F27/29H01F37/00H01F27/28H01F17/04H01F2017/002H01F41/00H01F2017/0066H01F17/00H05K3/40
Inventor 郑东晋具珍浒
Owner SAMSUNG ELECTRO MECHANICS CO LTD