Ceramic package and product encapsulation integrated machine

A ceramic shell, all-in-one technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high frequency affecting ergonomics, product stacking, and changeover adjustment, and achieve increased productivity, quality assurance, and stable positioning. Effect

A ceramic shell, all-in-one technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high frequency affecting ergonomics, product stacking, and changeover adjustment, and achieve increased productivity, quality assurance, and stable positioning. Effect

CN102820232BActive Publication Date: 2015-01-07RF360 TECH (WUXI) CO LTD
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  • Ceramic package and product encapsulation integrated machine
  • Ceramic package and product encapsulation integrated machine
  • Ceramic package and product encapsulation integrated machine

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] See figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8, the present invention comprises box body 1, and the upper surface of box body 1 is work table top 2, and feeding mechanism, unloading mechanism are installed on work table top 2, and feeding mechanism, unloading mechanism comprise tray carrying device, take-up platform 9, pallet The carrying device includes a material box 4, the material box 4 is a box body that runs through the front and back, the tray 3 is stacked in the material box 4, and the material box 4 is divided into a ceramic shell tray material box and a finished product tray material box, in which the materials for the ceramic shell tray are carried. The box is made by imitating the tray material box of the finished product. The purpose is to make the empty tray recovery cylinder 5 of the feeding mechanism and the unloading mechanism able to recover the empty tray on the reclaiming table 9 into the material box 4. Aft...

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Abstract

The invention provides a ceramic package and product encapsulation integrated machine so that ceramic package and product encapsulation are completed in a same device, therefore, the steps are uniform, the yield is improved, and the quality of encapsulated products is guaranteed. The ceramic package and product encapsulation integrated machine comprises a box body. A feed mechanism and a discharge mechanism, a conveyance positioning mechanism, a transfer mechanism, an image detection mechanism and a braiding mechanism are installed on a working table of the box body. The ceramic package and product encapsulation integrated machine is characterized in that a tray bearing device of the feed mechanism and the discharge mechanism comprises a material box. The conveyance positioning mechanism is located below a suction head device and comprises a horizontal vibrating track. The transfer mechanism is located outside the tail end of the horizontal vibrating track. The image detection mechanism is arranged at the edge of the tail end of the horizontal vibrating track and is located between the horizontal vibrating track and the transfer mechanism. The braiding mechanism is located at the edge of the transfer mechanism.

Description

technical field [0001] The invention relates to SMD (Surface Mount Device) product production process equipment, in particular to 3x3mm and 5x5mm ceramic shells and equipment in the taping and packaging process of finished products, specifically a ceramic shell and finished product packaging integrated machine. Background technique [0002] In the SMD production process, due to the unbalanced production requirements of various types of products, it is often necessary to replace the components in the equipment in the packaging process according to different product requirements, for example, the size difference between ceramic shells of different sizes, the difference between finished products of different sizes The difference in size, the difference between the ceramic shell and the finished product, the difference in the size of the carrier tray, and the difference in the production auxiliary materials used in the tape packaging process (carrier tape size), so that the equip...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information

Patent Timeline
07 Jan 2015
Publication
CN102820232B
IPC
H01L21/50; H01L21/56
Inventors
张光清