Flip-chip bonding method and device

Abstract

The invention provides a flip-chip bonding method and device. The method comprises: placing a first semiconductor chip on a package substrate, wherein a convex block of the first semiconductor chip is contacted with a first surface of the package substrate; fixing the package substrate; and heating the package substrate and the first semiconductor chip, wherein during the heating process, the deformation of the package substrate is restricted, and the first semiconductor chip can freely deform.

Description

technical field [0001] The present invention relates to semiconductor packaging, in particular, to a flip-chip bonding method and device for three-dimensional (3D) semiconductor packaging. Background technique [0002] Flip-chip bonding methods are known as follows. Firstly, a packaging substrate and a semiconductor chip are provided. The packaging substrate has a first surface and a second surface, and the semiconductor chip has an active surface and several bumps, and the bumps are located on the active surface. Then, the semiconductor chip is placed on the package substrate, and the bumps of the semiconductor chip contact the first surface of the package substrate. Then, a thermal pressure head is used to simultaneously press and heat the packaging substrate and the semiconductor chip, so that the bumps are bonded to the packaging substrate. [0003] The disadvantage of the known flip-chip bonding method is that the manufacturing cost of the thermal head is relatively ...

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of this known flip-chip bonding method is that the manufacturing cost of the thermocompression head is relatively high, and the thermocompression time must be relatively long

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