Electroplating solution recovery device

Abstract

The invention relates to an electroplating solution recovery device arranged below a treatment container of an electroplating apparatus. The treatment container comprises an upper cover, an electrode ring, a gasket, an insulating plate and a conductive plate, which are sequentially connected from the top down via conductive pieces. The recovery device communicates with a gap formed among the electrode ring, the gasket and the insulating plate, and is provided thereon with an evacuation unit for forming vacuum in the recovery device. The recovery device can easily discharge electroplating solution, to improve electroplating quality of small parts, and prolong service life of the treatment container.

Description

technical field [0001] The invention relates to an electroplating solution recovery device, which is mainly suitable for electroplating of small parts such as powders with a thickness of 0.1 to 5000 microns, ultra-small capacitors, resistors, diodes, connectors, spring switches, nails, screws, nuts, washers, etc. Background technique [0002] figure 1 It is a schematic cross-sectional front view showing one of conventional small parts surface treatment apparatuses as shown in Patent Document 1. In this electroplating treatment apparatus, the processing container containing the small parts is rotated by a vertical rotation axis, the small parts are brought into contact with the electrode ring, and the electroplating chemical in the processing container is energized from the electrodes while circulating the electroplating chemical from the inside of the processing container to the outside. Thereby electroplating small parts. The processing container has an outflow mechanism ...

AI Technical Summary

Problems solved by technology

In this way, the production cost of the whole equipment will increase, and the use cost will also increase at the same time

[0011] ②The gasket is connected to the insulating bottom plate and the electrode ring through conductive screws. The gap between the electrode ring and the insulating bottom plate is different according to the screw tightening torque. During the rotation process, it is easy to cause uneven force on the processing container. It leads to the deformation of the insulating bottom plate. When the deformation is large enough, the entire processing container will be scrapped, and the cycle of replacing parts will be more frequent, which will increase the cost of use.

Images