Simulation tool for high-speed communications links

A link simulation and communication link technology, applied in the field of simulation tools for high-speed communication links

Active Publication Date: 2013-01-09
ALTERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, PELE and other conventional behavior-based simulation tools are not always able to model high-speed communication links, such as link

Method used

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  • Simulation tool for high-speed communications links
  • Simulation tool for high-speed communications links
  • Simulation tool for high-speed communications links

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0122] Additional Embodiment 1.1. A method of simulating a communication link using a link simulation tool implemented on a computing device, wherein the communication link includes an associated link subsystem, and wherein the link subsystem Represented in the link simulation tool by a subsystem model, the method comprising: performing a two-dimensional convolution operation on the subsystem model to determine link performance for the communication link using the link simulation tool .

Embodiment approach 2

[0123] Additional embodiment 2. The method of additional embodiment 1, wherein said link subsystem comprises a conveyor subsystem represented by a conveyor subsystem model in said link simulation tool, and wherein performing said two A two-dimensional convolution operation includes performing a two-dimensional convolution operation with the conveyor subsystem model.

Embodiment approach 3

[0124] Additional embodiment 3. The method of additional embodiment 1, wherein said link subsystem comprises a receiver subsystem represented by a receiver subsystem model in said link simulation tool, and wherein performing said two A two-dimensional convolution operation includes performing a two-dimensional convolution operation with the receiver subsystem model.

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PUM

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Abstract

A link simulation tool for simulating high-speed communications link systems is provided. Communications links may include link subsystems such as transmit (TX) circuitry, receive (TX) circuitry, oscillator circuits that provide reference clock signals to the TX and RX circuitry, and channels that link the TX and RX circuitry. The link simulation tool may model each of the subsystems using behavioral models. The behavioral models may include characteristic functions such as transfer functions, probability density functions, and eye characteristics. The link simulation tool may have a link analysis engine that is capable of performing two- dimensional (two-variable) convolution operations and in applying dual-domain (frequency-time) transformations on the characteristic functions provided by the behavioral models to simulate the performance of the link system.; The link simulation tool may have an input screen that allows a user to specify desired link parameters and a data display screen that display simulated results.

Description

[0001] This application claims priority and benefit to US Patent Application 12 / 762,848, filed April 19, 2010. Background technique [0002] A typical communication link consists of a transmitter (TX) block, a receiver (RX) block, and a channel connecting the TX block to the RX block. The TX block transmits the serial data bit stream across the channel to the RX block. Typical high-speed transfer data rates can be as high as 10 Gbps (gigabits per second). Communication links operating at such high data rates are often referred to as high-speed serial links or high-speed I / O links. [0003] Circuit simulation tools such as SPICE have been used to simulate the behavior of communication links. The TX module of the communication link usually includes a driver circuit. SPICE can simulate the deterministic behavior of the driving circuit, but ignores non-deterministic effects such as noise and jitter. Simulating a communication link at the transistor level using HSPICE can often...

Claims

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Application Information

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IPC IPC(8): G06F9/455G06F17/50G06F11/25
CPCG06F17/5009G06F2217/10G06F2111/08G06F30/367G06F30/20
Inventor P·李M·斯玛瑙茨T·M·灿S·舒马拉耶夫
Owner ALTERA CORP
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