Unlock instant, AI-driven research and patent intelligence for your innovation.

Polishing pad, polishing method and polishing system

A grinding method and technology of grinding pads, which are applied in the direction of grinding devices, grinding machine tools, grinding tools, etc., to achieve the best grinding efficiency

Active Publication Date: 2016-12-14
IV TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the abrasive liquid is still stagnant in the circular groove, and only a small part flows to the surface of the abrasive layer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing pad, polishing method and polishing system
  • Polishing pad, polishing method and polishing system
  • Polishing pad, polishing method and polishing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] figure 1 is a schematic top view of a grinding system according to an embodiment of the present invention. figure 2 yes figure 1 A partially enlarged schematic view of the vehicle ring. Please refer to figure 1 as well as figure 2 , the polishing system of this embodiment includes a polishing pad 100 , a carrier 110 and a substrate S. The polishing pad 100 is used in combination with a carrier ring of a carrier 110 , and the polishing pad 100 includes a polishing layer 102 and a surface pattern 104 in the polishing layer 102 .

[0039] The abrasive layer 102 is made of, for example, a polymer substrate. The polymer substrate can be polyester, polyether, polyurethane, polycarbonate, polyacrylate, Polybutadiene, or other polymer substrates synthesized through suitable thermosetting resin or thermoplastic resin, etc. In addition to the polymer substrate, the abrasive layer 102 may further include conductive materials, abrasive particles, microspheres, or soluble ad...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A grinding pad, a grinding method and a grinding system. The grinding pad is used in combination with a carrier ring to grind a base material. The grinding pad has a moving direction during grinding, wherein the carrier ring has at least one carrier groove, and the base material has Substrate radius, the polishing pad includes a polishing layer and a surface pattern located in the polishing layer, the surface pattern has a plurality of transverse grooves, each tangent of the transverse groove has a non-zero angle with the tangent of the direction of motion, and the transverse groove Corresponding to the direction of motion, each has a transverse groove track, and each transverse groove track has a track width which is smaller than the radius of the base material. In addition, at the front end area of ​​the carrier ring relative to the moving direction, the transverse groove has at least one carrier compatible groove, and the at least one carrier compatible groove is aligned with the position of the at least one carrier groove.

Description

technical field [0001] The invention relates to a grinding pad, a grinding method and a grinding system, and in particular to a grinding pad, a grinding method and a grinding system which can provide different flow field distributions of grinding liquid. Background technique [0002] With the progress of the industry, the planarization process is often adopted as a process for producing various components. Among the planarization processes, the chemical mechanical polishing process is often used by the industry. Generally speaking, the chemical mechanical polishing process is by supplying a polishing liquid with a chemical mixture on the polishing pad, and applying a pressure to the substrate to be pressed on the polishing pad, and the substrate and the polishing pad are opposed to each other. sports. Under the mechanical friction generated by the relative motion and the chemical action of the polishing liquid, part of the surface layer of the substrate is removed, and the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B3/00B24B37/20B24B37/04H01L21/304
Inventor 王裕标
Owner IV TECH CO LTD